Photosensitive resin composition for photocuring rapid prototyping and preparation method and application of photosensitive resin composition

A photosensitive resin and composition technology, applied in the field of 3D printing, can solve the problems of low photosensitive resin molding conversion rate, inability to effectively improve the conversion rate, poor dimensional accuracy, etc., and achieve good surface accuracy and dimensional stability, Shore hardness The effect of high, high glass transition temperature

Active Publication Date: 2021-04-30
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The photosensitive resin composition provided by the present invention introduces photoinitiator and cationic thermal initiator, adopts the principle of two-step curing, combines photocuring reaction and cationic thermal curing reaction, and can effectively improve the later stage of photosensitive resin molded parts by thermal post-treatment. The conversion rate effectively solves the problem of fast laser scanning speed, low initial conversion rate of photosensitive resin, and weak UV penetration ability after UV curing, which cannot effectively improve the conversion rate, resulting in deformation of printed parts after a period of time, and poor dimensional accuracy. Problems such as yellowing of color; in addition, the use of hyperbranched epoxy resin and modified nano-spherical silica can effectively improve the heat resistance of the resin composition and the toughness of the cured product without increasing the viscosity of the resin system

Method used

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  • Photosensitive resin composition for photocuring rapid prototyping and preparation method and application of photosensitive resin composition
  • Photosensitive resin composition for photocuring rapid prototyping and preparation method and application of photosensitive resin composition
  • Photosensitive resin composition for photocuring rapid prototyping and preparation method and application of photosensitive resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0061] Among them, in the preparation process of modified nano-spherical silica 1#, hyperbranched epoxy resin HyPerE102 was selected; in the preparation process of modified nano-spherical silica 2#, hyperbranched epoxy resin HyPerDE1050 was selected.

[0062] The photosensitive resin compositions of the various embodiments of the present invention and comparative examples are prepared through the following processes: cationic photocurable components, free radical photocurable components, cationic photoinitiators, free radical photoinitiators, modified nano-spherical silica , antioxidant and thermal cationic initiator were stirred and mixed for 60 minutes at 25°C to obtain the product.

[0063] The photosensitive resin compositions of each embodiment and comparative example were subjected to critical exposure energy, curing depth, laser filling scanning speed, flexural strength, flexural modulus, tensile strength, elongation at break, Shore hardness, surface resistance and notch...

Embodiment 1～7 and comparative example 1～6

[0074] The present embodiment and comparative example provide a series of photosensitive resin compositions, the formulations of which are shown in Table 1 below.

[0075] The formula (part) of table 2 embodiment 1~7 and comparative example 1~5

[0076]

[0077]

[0078] In addition, a commercially available white material was used as Comparative Example 6.

[0079] The properties of the photosensitive resin compositions of the examples and comparative examples were measured according to the above-mentioned method, and the results are shown in Table 2.

[0080] The performance test result of each embodiment and comparative example of table 2

[0081]

[0082] It can be seen from Table 2 that the addition of surface-treated modified nano-spherical silica to the photosensitive resin composition provided by each embodiment of the present invention has basically no effect on the viscosity of the resin system, and there is no delamination and settlement after being placed...

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Abstract

The invention relates to a photosensitive resin composition for photocuring rapid prototyping as well as a preparation method and application of the photosensitive resin composition. The photosensitive resin composition comprises a cationic photocuring component, a free radical photocuring component, a cationic photoinitiator, a free radical photoinitiator, modified nano spherical silicon dioxide, hyperbranched epoxy resin, an antioxidant and a cationic thermal initiator. The photosensitive resin composition provided by the invention has high mechanical properties and shore hardness, and the dimensional stability and heat resistance of a later model are high.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a photosensitive resin composition for photocuring rapid prototyping, a preparation method and application thereof. Background technique [0002] Light-curing rapid prototyping technology (SLA) is the first rapid prototyping technology put into commercial application. Its specific working principle is as follows: use a computer program to control the ultraviolet laser to scan and move on the surface of the photosensitive resin, so that the photosensitive resin is cured to form a model. single layer. After each layer of photosensitive resin is cured, the curing platform will move a thickness of a single layer, and then the resin will fill the formed space through automatic flow or passive smearing, and then cure again. Repeat this to get the formed parts. Stereo-curing rapid prototyping technology can precisely control laser movement, has the advantages of low en...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/04C08L101/00C08K9/06C08K9/04C08K7/18B33Y70/10
CPCC08L63/00B33Y70/10C08K2201/011C08K2201/005C08L2205/035C08L2205/025C08L63/04C08L101/00C08K9/06C08K9/04C08K7/18
Inventor 雷周桥许卫民容敏智
Owner SUN YAT SEN UNIV
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