Method for improving bonding quality of silicon carbide seed crystals
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 北京汇琨新材料有限公司
- Publication Date
- 2021-04-30
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the auxiliary technical field of crystal growth, in particular to a method for improving the bonding quality of silicon carbide seed crystals. Background technique
[0002] The rapid development of traditional semiconductor materials represented by silicon and gallium arsenide has promoted the rapid development of microelectronics and optoelectronics technology. Applications in high-radiation environments are difficult to meet the growing demand. Therefore, the third-generation semiconductor materials with wide bandgap, high temperature resistance and high resistivity have become an increasingly urgent demand. Silicon carbide (SiC), as a representative of the third-generation semiconductor materials, is one of the most popular wide-bandgap semiconductor materials at present, and its excellent performance meets the new requirements of the above-mentioned device applications. As an important supplement to traditional semiconduc...