Method for improving drilling efficiency of high-density micro holes of circuit board

Abstract

The invention discloses a method for improving the drilling efficiency of high-density micro holes of a circuit board, which comprises the following steps: plating a layer of TaC film on the surface of a drill pin to form a film-plated drill pin, wherein the blade diameter of the film-coated drill point is 0.2 mm, and the blade length of the film-plated drill pin is larger than the sum of the thickness of the cover plate and the thickness of at least two production plates; stacking and placing at least two production plates on a drilling machine table board in an aligned mode, and arranging cover plates and base plates which are the same as the stacked production plates in size on the upper surfaces and the lower surfaces of the stacked production plates correspondingly; and then using the film-coated drill pin for drilling holes in the positions, needing to be drilled, of the production plates. The TaC film is plated on the surface of the conventional drill pin, so that the drilling capability of the drill pin is enhanced, the original drilling plate thickness can be changed from 1 PNL / stack to 2 PNL / stack for production, the drilling efficiency is effectively improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving the drilling efficiency of high-density tiny holes in a circuit board. Background technique [0002] Printed circuit board (PCB) is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Usually, when PCB is used in practice, due to the needs of wiring, structure, overcurrent, etc., it is necessary to carry out drilling processing and metallize these drilling holes. [0003] During the drilling process, in order to protect the PCB from damage and improve the hole position accuracy and hole wall quality of the drilled hole, it is necessary to cover a layer of cover plate on the top of the PCB and a layer of backing plate on the bottom. [0004] In the actual drilling production process, in order to improve production efficiency, the number of PCB st...

AI Technical Summary

Problems solved by technology

[0004] In the actual drilling production process, in order to improve production efficiency, the number of PCB stacks is often appropriately increased while ensuring the drilling accuracy and hole wall quality, that is, multiple PCBs are stacked together to drill holes. This method is generally applicable It is suitable for conventional large hole diameter (aperture generally>0.3mm), low drilling density, and low plate thickness drilling production; for batch high drilling density (60000 holes / PNL), high plate thickness (2mm), small hole diameter (<0.25 mm), due to the poor chip removal effect and the large friction loss of the drill pin, the existing technology can only arrange single-stack (1PNL / stack) drilling production, which seriously affects the production efficiency and leads to insufficient production capacity of the drilling process. production bottleneck