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High-thermal-conductivity and high-strength nano composite material and preparation method thereof

A nanocomposite material and composite material technology, which is applied in the field of high thermal conductivity and high strength nanocomposite materials and their preparation, can solve the problems of large amount of thermal conductive fillers, ineffective improvement of thermal conductivity, uneven dispersion of graphene, etc.

Active Publication Date: 2021-05-11
SHANGHAI UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] Chinese patent application publication number is CN10675177A discloses a kind of nylon 6-graphene thermal conductivity masterbatch and preparation method thereof, this method does not pass through filler functionalization and secondary Blending and drawing, directly melt extruding graphene and nylon 6, so that the graphene is unevenly dispersed in the matrix, and the effect of improving thermal conductivity is not obvious. At the same time, due to the large amount of thermal conductive filler added, and the price of graphene materials is relatively high , resulting in a higher overall material cost

Method used

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  • High-thermal-conductivity and high-strength nano composite material and preparation method thereof
  • High-thermal-conductivity and high-strength nano composite material and preparation method thereof
  • High-thermal-conductivity and high-strength nano composite material and preparation method thereof

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Embodiment 2

[0047] The high thermal conductivity and high strength nanocomposite material provided by the embodiment of the present invention and its preparation method are basically the same as in embodiment 1, the difference is that:

[0048] Preparation of polydopamine-modified graphene:

[0049] Using graphene as raw material, polydopamine-modified graphene was prepared by in-situ self-polymerization method: 3g graphene powder was dispersed in a mixed solution containing 0.225g buffer solution, 100mL isopropanol and 100mL deionized water, and ultrasonic treatment (200W, 25°C) for 30 minutes, use 4mol / L hydrochloric acid solution to adjust the pH of the above mixture to 8.5, add 9.6g of dopamine, stir and react at 60°C for 4 hours, wash and dry at 60°C to obtain polydopamine-modified Graphene powder.

[0050] Preparation of polydopamine-modified graphene / high-density polyethylene nanocomposites:

[0051] Add 0.3wt% polydopamine-modified graphene to 99.7wt% high-density polyethylene, ...

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Abstract

The invention discloses a high-thermal-conductivity and high-strength nano composite material which is characterized by being prepared from the following raw materials in percentage by weight: (1) 0.1-1.0 wt% of a polydopamine modified graphene composite material and (2) 99.0-99.9 wt% of high-density polyethylene through polymerization, blending, discharging, secondary blending and wire drawing. The invention also discloses a preparation method of the material. The preparation method comprises the following step of: adding dopamine into the spherical graphene to carry out in-situ auto-polymerization by virtue of an in-situ auto-polymerization method. According to the method, the polydopamine modified graphene is added into the high-density polyethylene, and secondary blending of the filler and the matrix and wire drawing are performed, so that the polydopamine modified graphene with low filler amount is uniformly dispersed in the matrix, the interface thermal resistance is reduced, and the comprehensive cost is low. The nano composite material provided by the invention has excellent heat conduction and mechanical properties, and can be widely applied to the heat dissipation fields of automobiles, computers, LEDs and the like.

Description

technical field [0001] The invention relates to the technical field of polymer composite materials, in particular to a nanocomposite material with high thermal conductivity and high strength and a preparation method thereof. Background technique [0002] With the high frequency and high speed of electronic devices and the rapid development of integrated circuit technology, electronic devices have higher and higher requirements for heat dissipation, and fast and effective thermal diffusion has become a very critical technology in material development. Polymer is an ideal thermal management material because of its easy preparation, light weight and low cost. [0003] High-density polyethylene has excellent mechanical properties, good electrical properties, wear resistance, oil resistance, solvent resistance, self-lubrication, corrosion resistance and good processing performance. Its output accounts for about 1 / 4 of the total global plastic output and is widely used in Automot...

Claims

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Application Information

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IPC IPC(8): C08L23/06C08K9/04C08K3/04C09K5/14
CPCC08K9/08C08K3/042C09K5/14C08L2207/062C08L23/06
Inventor 丁鹏曹文静
Owner SHANGHAI UNIV
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