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Halogen-free flame-retardant resin composition and application thereof

A technology of flame-retardant resin and resin composition, which is applied in the field of copper clad laminates, and can solve problems such as poor heat resistance and reduced process yield

Active Publication Date: 2021-05-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has the problem of poor heat resistance, and it is easy to cause a decrease in process yield during use.

Method used

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  • Halogen-free flame-retardant resin composition and application thereof
  • Halogen-free flame-retardant resin composition and application thereof
  • Halogen-free flame-retardant resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8、 comparative example 1-8

[0100] The above-mentioned examples and comparative examples each provide a halogen-free flame-retardant resin composition (see Table 1 for details of the formulas of the examples, and Table 2 for details of the formulas of the comparative examples, and the unit is parts by weight) and a copper-clad laminate, and the specific preparation method as follows:

[0101] (1) Mix the components in the formulation amount of the halogen-free flame-retardant resin composition uniformly in a mixed solvent of methyl ethyl ketone and DMF, and disperse uniformly at room temperature to obtain a resin glue with a solid content of 65%;

[0102] (2) Use the reinforcing material (glass fiber cloth) to impregnate the resin glue obtained in step (1), place it in a 160°C oven and bake for 5 minutes to achieve curing to obtain a prepreg; place the prepreg on two copper The foils are laminated and cured for 2 hours in a hot press at 210° C. and 2.1 MPa pressure to obtain the copper clad laminate.

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Abstract

The invention relates to a halogen-free flame-retardant resin composition and application thereof. The halogen-free flame-retardant resin composition comprises the following components in parts by weight: (A) 40-50 parts of epoxy resin, (B) 5-25 parts by weight of an anhydride compound represented by a formula I in the description, and (C) 50 to 200 parts by weight of a maleimide compound having a weight average molecular weight of 400 to 1000. According to the resin composition, the anhydride compound shown in the formula I and the maleimide compound with the weight-average molecular weight of 400-1000 are added into an epoxy resin system, so that the dielectric property and the heat resistance of a plate prepared from the resin composition can be improved at the same time, that is, the dielectric constant, the dielectric loss factor and the thermal expansion coefficient are reduced, the glass transition internal temperature is increased, the process yield is high, and the prepreg and the laminated board are enabled to have excellent glue filling performance.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a halogen-free flame-retardant resin composition and its application. Background technique [0002] With the advancement of 5G base stations and backbone networks, the deployment of 5G networks is accelerating. Portable terminal devices such as mobile phones and mobile tablets, as well as vehicle-mounted devices, require higher and higher signal transmission conversion rates. As an important part of the entire signal cycle, printed circuit boards and their substrates (CCL) will become more and more obstructive to electrical signals. Therefore, the market demand for low-dielectric halogen-free copper-clad laminates is strong, and it has become the main development in the industry. direction. [0003] On the other hand, due to the increase in the number of chips used and the progress of the chip mounting process, the excessive expansion coefficient of the substrate ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/36C08K5/5313C08G59/40C08G59/42C08J5/24C08K7/14H05K1/05H05K1/03B32B15/20B32B17/02B32B17/06B32B27/04B32B27/38
CPCC08L63/00C08J5/24C08G59/4042C08G59/4223C08G59/4284B32B5/02B32B15/20B32B15/14H05K1/05H05K1/0366H05K1/0373B32B2260/02B32B2260/046B32B2262/101B32B2307/306B32B2457/08C08L2201/02C08L2201/22C08L2201/08C08J2363/00C08K7/14C08K3/36C08K5/5313
Inventor 奚龙王碧武林伟许永静
Owner GUANGDONG SHENGYI SCI TECH
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