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Transparent single-component low-temperature curing adhesive and preparation method thereof

A one-component, adhesive technology, applied in the direction of adhesives, adhesive types, polymer adhesive additives, etc., can solve the problems of affecting the appearance of automobiles, long time required for complete curing, affecting production efficiency, etc. The effect of high temperature or long time baking, reducing energy cost and energy consumption, improving production capacity and work efficiency

Inactive Publication Date: 2021-05-28
东莞市帆朗电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The curing temperature of the existing epoxy resin-based adhesives is mostly between 100-150°C, or two-component curing at room temperature, both of which have disadvantages
The former has higher curing temperature or too long curing time, which is inconvenient and risky in the production and construction process, and is easy to damage the pasted components, resulting in high component loss and high energy consumption costs; the latter takes time to fully cure under normal temperature conditions Too long and the structural strength of the epoxy resin-based adhesive is not fully reflected, directly affecting production efficiency
[0004] In addition, the existing epoxy resin adhesive is white or light yellow after curing. If the adhesive is used on the surface of automobile glass, it will definitely affect the appearance of the automobile.

Method used

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  • Transparent single-component low-temperature curing adhesive and preparation method thereof
  • Transparent single-component low-temperature curing adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] This embodiment provides a transparent one-component low-temperature curing adhesive, the preparation method of which comprises the following steps:

[0024] S1, take 3 parts of ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer, 3 parts of bisphenol A epoxy resin, bisphenol F 70 parts of epoxy resin, 5 parts of amine curing agent, 40 parts of polythiol accelerator, 3 parts of thixotropic agent;

[0025] S2, ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer (prepared by Arkema France) and bisphenol A with mean particle diameter D50 of 30nm The epoxy resin was mixed and stirred for 3 hours at 80° C. to obtain a nano-modified bisphenol A epoxy resin;

[0026] S3, placing nano-modified bisphenol A epoxy resin and bisphenol F epoxy resin in a circulating cooling device at 23°C, adding hydrogenated castor oil thixotropic agent and stirring at high speed for 100min;

[0027] S4, after...

Embodiment 2

[0029] This embodiment provides a transparent one-component low-temperature curing adhesive, the preparation method of which comprises the following steps:

[0030] S1, take 2.5 parts of ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer by mass parts, 2.5 parts of bisphenol A epoxy resin, bisphenol F 90 parts of epoxy resin, 2 parts of amine curing agent, 30 parts of polythiol accelerator, 1 part of thixotropic agent;

[0031] S2, ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer (prepared by Arkema France) and bisphenol A with average particle diameter D50 of 50nm The epoxy resin was mixed and stirred for 3.5 hours at 90°C to obtain a nano-modified bisphenol A epoxy resin;

[0032] S3, placing nano-modified bisphenol A epoxy resin and bisphenol F epoxy resin in a circulating cooling device at 23°C, adding hydrogenated castor oil thixotropic agent and stirring at high speed for 90 minu...

Embodiment 3

[0035] This embodiment provides a transparent one-component low-temperature curing adhesive, the preparation method of which comprises the following steps:

[0036] S1, take 7.5 parts of ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer, 7.5 parts of bisphenol A epoxy resin, bisphenol F 90 parts of epoxy resin, 10 parts of amine curing agent, 50 parts of polythiol accelerator, 4 parts of thixotropic agent;

[0037] S2, ferrocenyl methyl methacrylate-butyl acrylate-ferrocenyl methyl methacrylate triblock copolymer (prepared by Arkema France) and bisphenol A with average particle diameter D50 of 10nm The epoxy resin was mixed and stirred for 4 hours at 80° C. to obtain a nano-modified bisphenol A epoxy resin;

[0038] S3, placing nano-modified bisphenol A epoxy resin and bisphenol F epoxy resin in a circulating cooling device at 26°C, adding hydrogenated castor oil thixotropic agent and stirring at high speed for 120min;

[0039] S...

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Abstract

The invention belongs to the technical field of adhesives, and particularly relates to a transparent single-component low-temperature curing adhesive which comprises the following components in parts by mass: 5-15 parts of nano modified bisphenol A epoxy resin, 70-90 parts of bisphenol F epoxy resin, 2-10 parts of an amine curing agent, 30-50 parts of a polythiol accelerant and 1-4 parts of a thixotropic agent, wherein the nano modified bisphenol A epoxy resin is formed by modifying a nano block copolymer and bisphenol A epoxy resin. The bisphenol A epoxy resin is modified by the nanoscale block copolymer and then is compounded with other components, so that the obtained adhesive is colorless and transparent after being cured, and the application field of the adhesive is greatly expanded; moreover, the fracture toughness is greatly improved, and the curing temperature is obviously reduced, so the curing time is greatly shortened, the problem that components cannot be baked at high temperature or for a long time in practical application is solved, the productivity and the working efficiency are improved, and the energy cost and the energy consumption are reduced.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a transparent one-component low-temperature curing adhesive and a preparation method thereof. Background technique [0002] Epoxy resin-based adhesives have excellent properties such as bonding strength, corrosion resistance, electrical insulation, and high strength, and are widely used in the fields of electronics, machinery manufacturing, and chemical anticorrosion. After the cross-linking reaction between the epoxy resin and the curing agent, the two-dimensional structure becomes a three-dimensional structure, and its excellent performance is reflected. The curing agents commonly used for epoxy resins include acid anhydrides, amines and synthetic resins. [0003] The curing temperature of the existing epoxy resin-based adhesives is mostly between 100-150° C., or two-component curing at room temperature, both of which have disadvantages. The former has higher curing tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/08
CPCC09J163/00C09J11/08C08L2205/03C08L2205/025C08L2201/10
Inventor 蔡向文
Owner 东莞市帆朗电子科技有限公司