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A kind of electrochemical polishing solution for copper foil surface pretreatment and application thereof

A surface pretreatment and electrochemical technology, applied in the direction of gaseous chemical plating, coating, metal material coating process, etc., can solve the problems of uneven polishing, low surface flatness, fast ion concentration migration speed, etc., to achieve the method The effect of being simple and easy to implement, simple in composition, and easy to promote in large-scale industrialization

Active Publication Date: 2022-02-08
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, chemical pickling is only a preliminary corrosion of the copper foil substrate, and the resulting surface flatness is very low
For electrochemical corrosion, copper foil is generally directly electrochemically polished by phosphoric acid, acetic acid, hydrochloric acid, sulfuric acid and other systems: on the one hand, it is difficult to deal with defects such as scratches and pits on the surface of copper foil; On the one hand, due to the fast migration speed of ion concentration in the polishing liquid system, in the process of polishing copper foil, too fast electrolysis leads to uneven polishing, which cannot play a polishing role, and it is difficult to improve its flatness

Method used

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  • A kind of electrochemical polishing solution for copper foil surface pretreatment and application thereof
  • A kind of electrochemical polishing solution for copper foil surface pretreatment and application thereof
  • A kind of electrochemical polishing solution for copper foil surface pretreatment and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Prepare according to the ratio of phosphoric acid 100g, sulfuric acid 30g, hydrochloric acid 5g, polyethylene glycol 8g, glycerin 5g, deionized water 25g, tributyl phosphate 1g, to obtain electrochemical polishing liquid;

[0049] Clean the prepared copper foil (2cm×10cm) with deionized water first, then apply an appropriate amount of pickling passivation paste to a scouring pad to wipe the copper foil repeatedly for two minutes, and finally rinse it with deionized water , dry with nitrogen;

[0050] The copper foil treated with pickling passivation paste was electrochemically polished. The positive and negative electrodes are controlled to be copper foil treated with pickling passivation paste, the distance between the positive and negative electrodes is 5-10cm, the polishing voltage is 8V, and the polishing time is 8 minutes;

[0051] Put in 10% H after electrochemical polishing 2 SO 4 Cleaning in the solution for 50 seconds, finally cleaning with deionized water, ...

Embodiment 2

[0054] Prepare according to the ratio of phosphoric acid 100g, sulfuric acid 30g, hydrochloric acid 5g, polyethylene glycol 8g, glycerin 5g, deionized water 25g, tributyl phosphate 1g, to obtain electrochemical polishing liquid;

[0055] Wash the prepared copper foil (2cm×10cm) with deionized water first, and then put it into the prepared pickling solution (20mL of nitric acid, 30mL of hydrochloric acid, 5mL of polyethylene glycol, 45mL of deionized water). for 2 minutes, finally remove it, rinse it with deionized water, and dry it with nitrogen;

[0056] Electrochemical polishing is performed on the copper foil treated with the acid solution. The positive and negative electrodes are controlled to be copper foil treated with acid solution, the distance between electrodes is 5-10cm, the polishing voltage is 8V, and the polishing time is 8min. Put in 10% H after electrochemical polishing 2 SO 4 The solution was cleaned for 50 seconds, and finally cleaned with deionized water,...

Embodiment 3

[0059] The electrochemical polishing solution in Example 1 is reused, and when the 18th to 20th copper foils are prepared, the polishing effect can still reach atomic level smoothness. Such as Figure 6 As shown, it is an optical microscope photo of the 20th copper foil sample processed.

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Abstract

The invention relates to an electrochemical polishing liquid for copper foil surface pretreatment and application thereof. In parts by mass, the components of the electrochemical polishing liquid include: 50-200 parts of phosphoric acid, 22-48 parts of sulfuric acid or / and hydrochloric acid parts, 10-20 parts of viscosity modifier, and 20-30 parts of deionized water.

Description

technical field [0001] The invention relates to an electrochemical polishing solution for copper foil surface pretreatment and application thereof, in particular to a method for synergistically treating copper foil by chemical pickling and electrochemical polishing of the above-mentioned electrochemical polishing solution. Background technique [0002] The chemical vapor deposition (CVD) method can effectively regulate the structure and number of layers of graphene on the surface of a specific catalyst substrate by designing and controlling the decomposition and deposition process of carbon atoms in a high-temperature and low-pressure environment. With ultra-low carbon solubility and similar thermal conductivity to graphene materials, it has become one of the most common catalyst materials in the preparation of graphene by CVD. [0003] During the CVD growth of graphene, the surface of the substrate (such as copper foil) is the nucleation and growth region of graphene. Duri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25F3/22C23G1/10C23C16/02
CPCC25F3/22C23G1/103C23C16/0227
Inventor 于云孙付通冯爱虎陈兵兵于洋米乐宋力昕
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI