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Preparation method of nano polyamide silicon spheres

A polyamide and aromatic polyamide technology, applied in the field of preparation of nano-polyamide silicon spheres, can solve the problems of large pollution, poor sealing effect, high hardness, etc., and achieves the improvement of anti-oxidation performance and the prevention of metal ion exudation. Effect

Inactive Publication Date: 2021-06-11
杨阳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing barrier materials are generally prepared with polymers as binders, adding metals or nanoparticles, so as to endow barrier materials with certain physical properties. Commonly used binders and solvents include bisphenols, acetonitrile, etc., and acetonitrile is used as Solvents can easily cause defects such as high hardness of the material after curing, and there are also problems such as large pollution of bisphenols and acetonitrile, high requirements for containers, and insufficient scope of application.
[0003] In addition, adding metal materials to polymer binders is prone to problems such as uneven dispersion, low utilization rate, and poor sealing effect due to poor compatibility between organic materials and inorganic particles.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The preparation method of the nano polyamide silicon sphere of the present embodiment, the raw material comprises the following components by weight:

[0019] 12 parts of methyl orthosilicate, 52 parts of aromatic polyamide, 30 parts of EPDM rubber, 7 parts of silicon dioxide, 5 parts of polylactic acid, 70 parts of carbon tetrachloride, 80 parts of dimethyl sulfoxide, embedded 7 parts of segment polymer; the nano-polyamide silicon sphere is a mesoporous hollow nano-polyamide silicon sphere, and the particle diameter of the silicon sphere is 50nm;

[0020] The method comprises the steps of:

[0021] Step 1, dissolving the block polymer in deionized water to obtain solution A;

[0022] Step 2. After mixing aromatic polyamide, EPDM rubber, polylactic acid, carbon tetrachloride and dimethyl sulfoxide, add dropwise to the solution A described in step 1. After the dropwise addition, continue stirring for 40 minutes to obtain System A;

[0023] Step 3. Add silicon dioxide ...

Embodiment 2

[0026] The preparation method of the nano polyamide silicon sphere of the present embodiment, the raw material comprises the following components by weight:

[0027] 10 parts of methyl orthosilicate, 50 parts of aromatic polyamide, 35 parts of EPDM rubber, 6 parts of silicon dioxide, 4 parts of polylactic acid, 60 parts of carbon tetrachloride, 70 parts of dimethyl sulfoxide, embedded 6 parts of segment polymer; the nano-polyamide silicon sphere is a mesoporous hollow nano-polyamide silicon sphere, and the particle diameter of the silicon sphere is 30nm;

[0028] The method comprises the steps of:

[0029] Step 1, dissolving the block polymer in deionized water to obtain solution A;

[0030] Step 2. After mixing aromatic polyamide, EPDM rubber, polylactic acid, carbon tetrachloride and dimethyl sulfoxide, add dropwise to the solution A described in step 1. After the dropwise addition, continue stirring for 30 minutes to obtain System A;

[0031] Step 3. Add silicon dioxide ...

Embodiment 3

[0034] The preparation method of the nano polyamide silicon sphere of the present embodiment, the raw material comprises the following components by weight:

[0035] 15 parts of methyl orthosilicate, 55 parts of aromatic polyamide, 25 parts of EPDM rubber, 8 parts of silicon dioxide, 6 parts of polylactic acid, 80 parts of carbon tetrachloride, 90 parts of dimethyl sulfoxide, embedded 8 parts of segment polymer; the nano-polyamide silicon sphere is a mesoporous hollow nano-polyamide silicon sphere, and the particle diameter of the silicon sphere is 60nm;

[0036] The method comprises the steps of:

[0037] Step 1, dissolving the block polymer in deionized water to obtain solution A;

[0038] Step 2. After mixing aromatic polyamide, EPDM rubber, polylactic acid, carbon tetrachloride and dimethyl sulfoxide, add dropwise to the solution A described in step 1. After the dropwise addition, continue stirring for 50 minutes to obtain System A;

[0039] Step 3. Add silicon dioxide ...

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Abstract

The invention discloses a preparation method of nano polyamide silicon spheres. The preparation method comprises the following steps: 1, dissolving a block polymer in deionized water to obtain a solution A; 2, mixing aromatic polyamide, ethylene propylene diene monomer, polylactic acid, carbon tetrachloride and dimethyl sulfoxide, then dropwise adding into the solution A, and continuously stirring for 30-50 min after drop-by-drop adding is completed, so as to obtain a system A; 3, adding silicon dioxide and tetraethoxysilane into the system A to carry out polymerization reaction; and 4, carrying out centrifugal separation, drying and roasting to obtain the nano polyamide silicon spheres. According to the method, the block polymer is used as a template, tetraethoxysilane is used as a silicon source, silicon dioxide is used as a hardening agent, aromatic polyamide is used as a main raw material, ethylene propylene diene monomer, silicon dioxide, polylactic acid, carbon tetrachloride and dimethyl sulfoxide are used as auxiliary materials, and the obtained silicon sphere material can effectively block metal ion seepage and improve the oxidation resistance of the material.

Description

technical field [0001] The invention belongs to the technical field of barrier materials, and in particular relates to a preparation method of nano polyamide silicon spheres. Background technique [0002] At present, as people have higher and higher health and safety requirements for food products, higher requirements have been placed on the physical and chemical properties of food product packaging. an effective approach. Barrier materials refer to materials with functions such as heat resistance, flame resistance, compression resistance, and wear resistance. The requirements for materials mainly include the tensile strength and fracture strength of materials, and also require materials to have certain heat resistance and aging resistance. performance. Existing barrier materials are generally prepared with polymers as binders, adding metals or nanoparticles, so as to endow barrier materials with certain physical properties. Commonly used binders and solvents include bisph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/12B82Y40/00
CPCB82Y40/00C01B33/12C01P2004/34C01P2004/64
Inventor 不公告发明人
Owner 杨阳