Printed circuit board copper-containing wastewater treatment process

A technology for wastewater treatment and printed circuit boards, which is used in water/sewage treatment, multi-stage water/sewage treatment, oxidized water/sewage treatment, etc. It can solve the problems of poor purification effect, high production cost, and complicated operation by staff. , to reduce the consumption of raw materials, reduce production costs, and improve the effect of breaking the network

Active Publication Date: 2021-06-15
成都明天高新产业有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

EDTA is easy to form a stable complex with copper, which increases the difficulty of copper ion degradation, and the simple use of sodium hypochlorite to break the complex has poor effect
[0005] (2)Na 2 S is an alkaline substance, put Na 2 After S, the pH further increased, and the pH was too high to cause the Al(OH) produced by adding PAC to water 3 The colloid is dissolved and needs to be flocculated and precipitated by adding H 2 SO 4 Reverse the pH to 6~9, Al(OH) will be produced during the reverse adjustment process 3 Precipitation, resulting in white milky wastewater, poor purification effect, and the consumed Na 2 S and H 2 SO 4 The quantity is large, the production cost is high, the treatment of copper ions is not complete, and the operation of the staff is complicated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;

[0046] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;

[0047] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;

[0048] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 8.5;

[0049] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;

[0050] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;

[0051] S7: Adve...

Embodiment 2

[0053] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;

[0054] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;

[0055] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;

[0056] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 8.0;

[0057] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;

[0058] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;

[0059] S7: Adve...

Embodiment 3

[0061] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;

[0062] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;

[0063] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;

[0064] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 9.0;

[0065] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;

[0066] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;

[0067] S7: Adve...

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PUM

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Abstract

The invention provides a printed circuit board copper-containing wastewater treatment process which comprises the following steps: S1, collecting printed circuit board copper-containing wastewater in a waste liquid pool, adding a NaClO solution into the wastewater, and adjusting the pH value of the waste liquid to 4.0-6.0; S2, introducing the wastewater treated in the step S1 into an irradiation tank, and irradiating the wastewater by using ultraviolet light; S3, introducing the wastewater treated in S2 into a complex breaking tank, adding a Fenton reagent into the complex breaking tank, and conducting stirring; S4, introducing the wastewater treated in S3 into a sedimentation tank, and simultaneously adding NaOH and Na2S with the weight ratio of 5:4 into the sedimentation tank; S5, introducing the wastewater treated in S4 into a coagulating basin, and adding PAC into the coagulating basin; S6, introducing the wastewater treated in the step S5 into a flocculation basin, and adding PAM into the flocculation basin; and S7, carrying out advection precipitation to obtain treated wastewater. The copper ions in the copper-containing wastewater in the production of the printed circuit board can be effectively removed.

Description

technical field [0001] The invention relates to the technical field of wastewater treatment, in particular to a process for treating copper-containing wastewater from the production of printed circuit boards. Background technique [0002] Printed circuit board (PCB) electroplating copper plating needs to use tap water to wash inorganic metal ions, organic matter and colloids and other substances on the circuit board, so the discharged wastewater contains a large amount of copper ions, and wastewater treatment is required. The main forms of copper ions in the plating solution are copper sulfate, copper pyrophosphate, cuprous cyanide, etc. The damage of copper ions to the water body is that when it exceeds a certain amount, it will inhibit the natural purification of the water body. For example, after copper-containing wastewater enters the farmland, copper will also be enriched in the soil, deteriorating the soil quality, and will be absorbed by plants, polluting crops, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/08C02F101/20
CPCC02F9/00C02F1/66C02F1/32C02F1/5236C02F1/56C02F1/725C02F1/76C02F1/722C02F2305/026C02F2305/10C02F2101/20Y02P10/20
Inventor 王劲林立明唐永林
Owner 成都明天高新产业有限责任公司
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