A kind of photocuring coating and its preparation method and application
A technology of light-curing coatings and silicon carbide, which is applied in the direction of fire-resistant coatings, polyurea/polyurethane coatings, coatings, etc., and can solve problems such as physical hazards
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[0038] The present invention also provides a preparation method for the photocurable coating, comprising the following steps:
[0039] (1) Mix polyurethane acrylic resin, active monomer, solvent and anti-sedimentation agent to obtain solution A;
[0040] (2) Mix the solution A and the remaining components to obtain the photocurable coating.
[0041] In the present invention, the mixing temperature in the step (1) is preferably 60-70°C, more preferably 62-68°C, more preferably 64-66°C.
[0042] In the present invention, the mixing in the step (1) is preferably carried out under stirring, and the stirring speed is preferably 6000-7000rpm, more preferably 6200-6800rpm, more preferably 6400-6600rpm; the stirring time Preferably it is 0.5-1 h, More preferably, it is 0.6-0.9 h, More preferably, it is 0.7-0.8 h.
[0043] In the present invention, the mixing temperature in the step (2) is preferably 40-50°C, more preferably 42-48°C, more preferably 44-46°C.
[0044] In the present ...
Embodiment 1
[0048] 65 parts of polyurethane acrylic resin, 25 parts of isobornyl acrylate, 13 parts of benzophenone, 30 parts of toluene, 8 parts of montmorillonite, 5 parts of sodium polyacrylate, 6 parts of magnesium oxide, 14 parts of filler;
[0049] The mass ratio of silicon carbide and borax in the filler is 1:0.45, and the silicon carbide has a particle size of less than or equal to 5 μm, a particle size of greater than 5 μm and less than or equal to 15 μm, and a particle size of greater than 15 μm and less than or equal to 20 μm The mass ratio of the component with a particle size greater than 20 μm and less than or equal to 25 μm is 1:2.5:1.5:0.6.
[0050] It was prepared according to the following method: Stir polyurethane acrylate, isobornyl acrylate, toluene and montmorillonite at 65°C and 6500rpm for 0.8h to obtain solution A; mix solution A, benzophenone, sodium polyacrylate, The magnesia and filler were stirred at 45° C. and 3500 rpm for 5 hours to obtain a photocurable coa...
Embodiment 2
[0053] 60 parts of polyurethane acrylic resin, 28 parts of 1,3-butanediol diacrylate, 12 parts of 1-hydroxycyclohexyl benzophenone, 35 parts of xylene, 6 parts of attapulgite, 8 parts of polyacrylamide, 9 parts of magnesium oxide parts, 12 parts of filler;
[0054]The mass ratio of silicon carbide and borax in the filler is 1:0.6, and the silicon carbide has a particle size of less than or equal to 5 μm, a particle size of greater than 5 μm and less than or equal to 15 μm, and a particle size of greater than 15 μm and less than or equal to 20 μm The mass ratio of the component with a particle size greater than 20 μm and less than or equal to 25 μm is 1:2:1:0.7.
[0055] It was prepared according to the following method: Stir polyurethane acrylate, 1,3-butanediol diacrylate, xylene and attapulgite at 70°C and 7000rpm for 0.5h to obtain solution A; mix solution A, 1-hydroxy Cyclohexylbenzophenone, polyacrylamide, magnesium oxide and filler were stirred at 40° C. and 3800 rpm fo...
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