Special adhesive for hollow composite insulator and preparation method thereof

A technology of composite insulators and adhesives, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problem of no suitable adhesive

Pending Publication Date: 2021-06-25
EXAMING & EXPERIMENTAL CENT OF ULTRAHIGH VOLTAGE POWER TRANSMISSION COMPANY CHINA SOUTHEN POWER GRID
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a special adhesive for hollow composite insulators and its preparation me

Method used

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  • Special adhesive for hollow composite insulator and preparation method thereof
  • Special adhesive for hollow composite insulator and preparation method thereof
  • Special adhesive for hollow composite insulator and preparation method thereof

Examples

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Embodiment 1

[0052] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:

[0053]A component: epoxy resin E51 100 parts, nano AL 2 o 3 1.5 parts, 1 part of 3-glycidyloxypropyltrimethoxysilane, 10 parts of acetone, SiO 2 150 servings.

[0054] nano-AL 2 o 3 With an average particle size of 20 nm, SiO 2 The mesh number is mineral pure 200 mesh.

[0055] Component B: 65 parts of methyl tetrahydrophthalic anhydride, 70 parts of alumina powder, 1 part of DMP-30, 25 parts of PSPA, 0.5 part of BYK-410. The mesh number of alumina powder is 270 mesh.

[0056] Preparation process:

[0057] Prepare component A:

[0058] (1) Mix 1 part of 3-glycidyl etheroxypropyl trimethoxysilane and 10 parts of acetone, adjust the pH value to 4 and add nano-AL 2 o 3 , mechanically stirred for 0.5 hours under the assistance of ultrasonic waves to obtain a dispersion liquid, whi...

Embodiment 2

[0069] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:

[0070] A component: epoxy resin E51 110 parts, nano AL 2 o 3 2 parts, 3~0.5 parts of glycidyl etheroxypropyl trimethoxysilane, 12 parts of acetone, SiO 2 160 copies.

[0071] nano-AL 2 o 3 With an average particle size of 30 nm, SiO 2 The mesh number is mineral pure 200 mesh.

[0072] Component B: 70 parts of methyl tetrahydrophthalic anhydride, 80 parts of alumina powder, 1 part of DMP-30, 30 parts of PSPA, and 1 part of BYK-410. The mesh number of alumina powder is 270 mesh.

[0073] Preparation process:

[0074] Prepare component A:

[0075] (1) Mix 0.5 parts of 3-glycidyl etheroxypropyl trimethoxysilane and 12 parts of acetone, adjust the pH value to 7, add nano-AL 2 o 3 , and mechanically stirred for 1 hour under the assistance of ultrasonic waves to obtain a dispersion, ...

Embodiment 3

[0085] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:

[0086] A component: epoxy resin E44 90 parts, nano AL 2 o 3 1 part, 0.5 parts of γ-aminopropyltriethoxysilane, 8 parts of butyl acetate, SiO 2 120 servings. nano-AL 2 o 3 With an average particle size of 20 nm, SiO 2 The mesh number is 200 mesh.

[0087] Component B: 60 parts of methyl hexahydrophthalic anhydride, 60 parts of alumina powder, 1 part of DMP-30, 20 parts of PSPA, 0.5 part of BYK-410. The mesh number of alumina powder is 270 mesh.

[0088] Preparation process:

[0089] Prepare component A:

[0090] (1) Mix 0.5 parts of γ-aminopropyltriethoxysilane and 8 parts of butyl acetate, adjust the pH value to 6 and add nano-AL 2 o 3 , and mechanically stirred for 1 hour under the assistance of ultrasonic waves to obtain a dispersion, which was set aside;

[0091] (2) Add e...

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Abstract

The invention relates to the technical field of adhesives, and discloses a special adhesive for a hollow composite insulator and a preparation method of the special adhesive, and the special adhesive comprises the following components in parts by mass: a component A: 90-110 parts of epoxy resin, 1-2 parts of nano aluminum oxide, 0.5-1 part of a silane coupling agent, 8-12 parts of an organic solvent and 120-160 parts of a filler a; The component B comprises the following components in parts by weight: 60-70 parts of a curing agent, 20-30 parts of a toughening agent, 1 part of an accelerant, 60-80 parts of filler b and 0.5-1 part of a flatting agent; The mass ratio of the component A to the component B is 1: 1. The curing time of the current common adhesive is about 2 hours, and the curing time of the adhesive disclosed by the invention is 30-45 minutes; According to the method, the damage test is carried out on a hollow composite insulator sample, and the final damage value is increased by about 13% compared with the prior art. Therefore, the adhesive has the characteristics of good bonding performance, high impact toughness, moderate viscosity, rapid curing and the like, is particularly suitable for an end connection structure in interference fit, and is high in process applicability.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a special adhesive for hollow composite insulators and a preparation method thereof. Background technique [0002] With the construction of AC and DC projects in power grids, hollow composite insulators have been widely used. As an important component of electrical equipment, hollow composite insulators are mainly subjected to various electrical and mechanical stresses, and their reliability is crucial to the safe and reliable operation of the equipment itself. Hollow composite insulators are mainly composed of silicone rubber sheaths, insulating tubes and metal flanges. The metal flange and the insulating pipe are usually glued. The mechanical properties of the hollow composite insulator mainly depend on the strength of the insulating pipe and the connection design of the insulating pipe and the flange. At present, the common connection methods mainly include clearance fit a...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J11/08C08G59/42C08G59/68
CPCC09J163/00C09J11/04C09J11/08C08G59/4223C08G59/686C08K2201/011C08K2003/2227C08K2201/014C08K2201/005C08L2205/025C08L2205/03
Inventor 韦晓星卢文浩肖翔李西育刘广义党镇平魏劲容
Owner EXAMING & EXPERIMENTAL CENT OF ULTRAHIGH VOLTAGE POWER TRANSMISSION COMPANY CHINA SOUTHEN POWER GRID
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