An integrated mos adaptively controlled soi LIGBT
An adaptive control, bottom-up technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of weakening the conductance modulation effect and increasing the voltage drop of the device, achieving low turn-off loss and low forward conduction. Effects of on-voltage drop and long short-circuit withstand time
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[0016] Such as figure 1 As shown, the structure of this example includes an integrated MOS self-adaptive control SOI LIGBT, including a P substrate 1, a buried oxide layer 2, and a top semiconductor layer that are sequentially stacked from bottom to top; the top semiconductor layer has an N-type Doping, along the lateral direction of the device, both ends of the upper layer of the top semiconductor layer have a P well region 5 and an N-type buffer layer 4, and the N-type semiconductor between the P well region 5 and the N-type buffer layer 4 is an N drift region 3; the upper layer of the N-type buffer layer 4 has a P+ anode region 6, and the lead-out end of the P+ anode region 6 is an anode; the upper layer of the P well region 5 has an integrated MOS structure in the direction close to the N-type buffer layer 4, and is arranged side by side. The P+ region 8 and the N+ region 7, the fourth P+ body contact region 23, and the integrated MOS structure and the P+ region 8 are isol...
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