Packaging structure of high-power LED device

Abstract

The invention discloses a packaging structure of a high-power LED device, and relates to the field of semiconductor illumination. The packaging structure comprises a substrate, an LED chip fixedly connected with the substrate, a heat insulation layer covering the LED chip, and a fluorescent powder layer which is arranged above the heat insulation layer and realizes white light of different color temperatures of the LED device. A copper layer is deposited on the surface of the substrate, and a reflecting wall surrounding the LED chip is deposited on the copper layer. According to the packaging structure of the high-power LED device provided by the invention, the heat insulation layer is arranged between the LED chip and the fluorescent powder layer, so that the problems that the service life of fluorescent powder in the light conversion layer is influenced by heat generated by a high-power LED in a high-current working process, and the luminous efficiency, the service life and the like of the LED are influenced are effectively solved, and then the service life of the LED device is greatly prolonged. The method has the advantages of simple preparation, high conversion efficiency, low cost and the like.

Description

technical field [0001] The invention belongs to the field of semiconductor lighting, and in particular relates to a package structure of a high-power LED device. Background technique [0002] LED refers to a light-emitting diode, which is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc., and can radiate visible light when electrons and holes recombine; among them, gallium arsenide diode emits Red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. [0003] Generally, LED chips have three types of chip structures: front-mount, vertical, and flip-chip. The p and n electrodes of the front-mounted structure and the flip-chip LED chip are on the same side of the LED chip. The chip is prone to current crowding under high current, resulting in a large amount of heat generated inside the chip, and the thermal resistance is high. High-power LED lamps need t...

AI Technical Summary

Problems solved by technology

Generally, the packaging of white LEDs needs to evenly spray phosphor powder on the surface of blue LED chips. The phosphor powder is in direct contact with the LED chip, but it is prone to overheating under long-term high-current working conditions, which will reduce the luminous efficiency of the phosphor powder. thus reducing the lifetime of the LED device

In order to make the light more concentrated, some LED lamps will be equipped with reflective walls, but the reflective walls will absorb a lot of heat, resulting in high temperature of LED devices, even if some LED devices are separated from the phosphor and the LED chip, the problem of poor heat dissipation It is also easy to reduce the luminous efficiency of phosphor powder, thereby reducing the life of LED devices

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