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Preparation method of open type all-diamond heat dissipation structure

A heat dissipation structure, diamond technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, to achieve the effect of large area, easy layout design, small thermal expansion coefficient

Active Publication Date: 2021-07-23
UNIV OF SCI & TECH BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At the same time, since diamond is the hardest material known and has excellent corrosion resistance to almost all chemical substances, it leads to the challenge of fabricating all-diamond microstructures, especially complex internal structures with non-single channels, such as internal Open all-diamond microstructure with columnar structure

Method used

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  • Preparation method of open type all-diamond heat dissipation structure

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Experimental program
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Effect test

Embodiment 1

[0044] The polished molybdenum plate with a thickness of 5 mm is precisely drilled to obtain circular through holes with a diameter of 3 mm, and the distance between each hole is 5 mm. Using Nd:YAG laser with a current of 65A, a frequency of 100Hz, and a laser feed speed of 100mm / min, a diamond thick plate with a thickness of 5mm was cut to obtain a 5mm long diamond rod. The diamond rods are sequentially filled into the through holes of the molybdenum plate to ensure that the upper and lower surfaces of the molybdenum plate are consistent in level. Place the molybdenum plate filled with diamond rods on a diamond polishing disc, and add diamond nanopowder solution for double-sided polishing. Diamond micropowders with a particle size of 500nm, 200nm, and 50nm were used for grinding and pre-polishing for 50 hours respectively. Then change the particle size of diamond powder to 20nm and 10nm in turn, and repeat the above steps. Then it is placed on a precision diamond polishing ...

Embodiment 2

[0046] The polished molybdenum plate with a thickness of 3mm is precisely drilled to obtain 3mm circular through holes, and the distance between each hole is 3mm. A Nd:YAG laser was used to cut a diamond slab with a thickness of 3 mm at a current of 70 A, a frequency of 150 Hz, and a laser feed speed of 100 mm / min to obtain a 3 mm long diamond rod. The diamond rods are sequentially filled into the through holes of the molybdenum plate to ensure that the upper and lower surfaces of the molybdenum plate are consistent in level. Place the molybdenum plate filled with diamond rods on a diamond polishing disc, and add diamond nanopowder solution for double-sided polishing. Diamond micropowders with a particle size of 500nm, 200nm, and 50nm were used for grinding and pre-polishing for 50 hours respectively. Then change the particle size of diamond powder to 20nm and 10nm in turn, and repeat the above steps. Then it was placed on a precision diamond polishing disc, and the linear s...

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Abstract

The invention discloses a preparation method of an open type all-diamond heat dissipation structure, and belongs to the field of semiconductor device heat dissipation. A through hole structure of a molybdenum plate is realized through precision machining; then laser cutting is carried out on a high-quality self-supporting thick diamond plate to obtain diamond rods matched with the hole shape of the molybdenum plate, and the through hole of the molybdenum plate is filled with the diamond rods; then diamond growth is carried out on the upper surface and the lower surface of the molybdenum plate filled with the diamond rods until full coverage of diamond on the surface is achieved and certain thickness is achieved; and finally, the open type all-diamond structure is obtained by removing the molybdenum plate, so that effective heat dissipation under the extreme conditions of high heat flux density, strong heat flux impact, space navigation space environment and the like is realized. According to the method, the diamond thick plate which is large in area, fast in growth speed, uniform and compact and excellent in quality is prepared by adopting a direct-current arc plasma jet CVD technology, and therefore the diamond rods in different shapes can be formed, and the requirements of the open type all-diamond heat dissipation structures with different sizes and shapes can be met.

Description

technical field [0001] The invention belongs to the field of heat dissipation of high heat flux electronic devices, and in particular provides a preparation method of an open all-diamond heat dissipation structure. The feature is that the through-hole structure of the molybdenum plate is realized through precision machining. Diamond rods matching the hole shape of the molybdenum plate are obtained by laser cutting a high-quality self-supporting diamond plate, and filled into the holes of the molybdenum plate. Subsequently, diamond growth is carried out on the upper and lower sides of the molybdenum plate filled with diamond rods, until the surface is fully covered by diamonds and has a certain thickness. Finally, an open all-diamond heat dissipation structure is obtained by removing the molybdenum plate to achieve effective heat dissipation under extreme conditions such as high power, high heat flow, and space environment. [0002] technical background [0003] Among the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00C23C16/01C23C16/27C23C16/503
CPCB23P15/00C23C16/272C23C16/503C23C16/01
Inventor 郑宇亭李成明李世谕魏俊俊刘金龙陈良贤安康欧阳晓平
Owner UNIV OF SCI & TECH BEIJING