Flexible miniature capacitor and preparation method thereof

Abstract

The invention discloses a flexible miniature capacitor and a preparation method thereof. The flexible miniature capacitor comprises a flexible substrate; a conductive base which is used for conducting a circuit and is arranged on the flexible substrate, wherein the conductive substrate is divided into a first part of substrate and a second part of substrate arranged on the outer side of the first part of substrate by an electrode groove; a capacitor unit which is arranged on the conductive substrate and comprises a first electrode arranged on the first part of the substrate; and a second electrode which is arranged on the second part of the substrate; the electrode groove is suitable for providing an insulating medium between the first electrode and the second electrode; wherein the conductive substrate and the first electrode are both made of a material comprising two-dimensional titanium carbon; and the second electrode is made of a material including zinc. The flexible miniature capacitor has the advantages of being small in size, high in charging speed, safe, convenient to use and capable of being carried, and meanwhile the stored capacitance meets the daily use requirement of wearable equipment.

Description

technical field [0001] The invention belongs to the technical field of flexible energy storage, and in particular relates to a flexible microcapacitor and a preparation method thereof. Background technique [0002] The boom in the electronics industry is fueled by a new wave of flexible and wearable electronics, including transdermal drug delivery patches, implantable medical devices, foldable displays, artificial electronic skin, and smart clothing, among others. Since most flexible electronic components are driven by electricity, there is a constant need for advanced flexible power sources. However, current power supplies are generally too thick, too bulky, too rigid, and too heavy to meet the requirements of flexible energy storage. For this reason, it is particularly important to manufacture a kind of miniature flexible electronic device. [0003] Micro supercapacitors (microcapacitors) are mainly composed of three parts: current collectors, electrode materials and ele...

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Problems solved by technology

At present, flexible microcapacitors mainly adopt three structures: 1. Sandwich structure, that is, the flexible substrate, electrode material, and electrolyte are relatively assembled. The disadvantage of this structure is that the device is thick and heavy, resulting in poor user experience when used in wearable devices; 2. Linear structure, there are three common assembly methods, 1) the surface of the zinc wire is covered with a diaphragm layer and a cathode layer in turn, and then packaged into a coaxial cable structure, 2) a separator is placed between the cathode fiber and the zinc wire, and the cathode and the zinc wire are parallel But not coaxial, all parts are sealed in heat-shrinkable plastic tube, 3) yarn cathode and zinc fiber are wound in parallel on stretchable fiber, then gel electrolyte is applied between electrodes (also acts as separator) , forming a double-helix structure, these linear structures have the advantage of weaving, satisfying the intelligent integration of multiple electronic products, such as smart watches, smart cloth, smart glasses and flexible displays, but it is difficult to meet the application of some ultra-thin electronic products ;3. Planar structure, making square, interdigitated or circular electrodes by laser etching or printing. Although this method can form a dense film, the selection of materials for preparing printable paste is relatively Narrow and strict, and the cost is high

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