A ceramic package base

A ceramic packaging and base technology, used in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as poor bonding with aluminum nitride ceramics, achieve low wiring resistance, and solve the problem of heat dissipation , the effect of high thermal conductivity

Active Publication Date: 2022-07-22
CHAOZHOU THREE CIRCLE GRP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] The present invention uses the co-firing technology of aluminum nitride and tungsten, by adding rare earth oxides in the tungsten metal slurry as the ceramic liquid phase, so as to supplement the lack of liquid phase in the ceramic body during the sintering process, so as to achieve Under the premise of high thermal conductivity, it also solves the problem of poor bonding between tungsten metal paste and aluminum nitride ceramics

Method used

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  • A ceramic package base
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Embodiment Construction

[0071] The content of the present invention will be further described in detail below through specific embodiments. Unless otherwise specified, the raw materials, reagents or devices used in the examples and comparative examples can be obtained from conventional commercial channels, or can be obtained by methods of the prior art. Unless otherwise specified, test or test methods are routine in the art.

[0072] The samples of Examples and Comparative Examples were prepared by using tungsten paste and aluminum nitride ceramic paste for testing. Among them, the tungsten paste is made of tungsten powder, Al 2 O 3 Powder and Rare Earth Oxides M 2 O 3 , and add an appropriate amount of organic solvent, polymer and additives to mix and formulate; among them, inorganic components (tungsten powder, Al 2 O 3 Powder and Rare Earth Oxides M 2 O 3 ) is about 80% by mass in the tungsten paste. After the tungsten paste is sintered and formed, a tungsten conductive layer is obtained....

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Abstract

The invention discloses a ceramic packaging base. This ceramic package base includes an insulating base and a tungsten conductive layer; the tungsten conductive layer is disposed on at least one surface of the insulating base; the insulating base is formed of aluminum nitride ceramics; wherein, the tungsten conductive layer includes W, Al and M, where M represents rare earth elements. The aluminum nitride ceramic package base prepared by the invention has high thermal conductivity, good bonding force of the conductive layer and low wiring resistance. This aluminum nitride ceramic package base is suitable for the sensor field, especially the high-power TOF module package, which not only solves the problem of heat dissipation, but also meets the requirements of the TOF working environment.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a ceramic packaging base. Background technique [0002] The full name of TOF is Time of Flight. It uses the time-of-flight ranging method, which is more suitable for measuring distant objects and is widely used in the field of 3D sensing. For example, the mobile phone is equipped with a TOF module on the rear camera to realize 3D face recognition. The TOF module includes a package base and a chip mounted on the package base. The function of the package base is to ensure that it is not disturbed by the external environment, to ensure the working accuracy and to prolong the working life. Common packaging bases generally include: an insulating substrate with an electronic component mounting portion, a frame body disposed on the insulating substrate and surrounding the mounting portion, and a conductive pattern layer formed on the insulating substrate; after the electronic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/15H01L23/373
CPCH01L23/14H01L23/15H01L23/3731H01L23/3735H01L23/3736
Inventor 李钢邱基华
Owner CHAOZHOU THREE CIRCLE GRP
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