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Preparation method of micron-sized ultrathin metal sheet for conductive adhesive

A micron-scale, metal sheet technology, applied in conductive adhesives, metal material coating processes, devices for coating liquids on surfaces, etc., can solve the problems of cumbersome preparation methods and high costs, and achieve changes in cumbersome steps and simple methods. , work efficiency, fast and efficient effect

Pending Publication Date: 2021-08-03
青沃精密仪器(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for preparing a micron-sized ultra-thin metal sheet for conductive adhesive in order to solve the problems of cumbersome preparation methods and high cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0022] A method for preparing a micron-scale ultra-thin metal sheet for conductive adhesive, comprising the following steps:

[0023] Step 1: Ingredients, mix 45-68 parts of raw material polyvinyl formal, 20-30 parts of artificial protein powder colloid, and 10-15 parts of zinc oxide according to the ratio through an electronic scale;

[0024] Step 2: Stir, pour the raw materials prepared in proportion into the mixer, and stir for 35 minutes at a speed of 120-150 rpm;

[0025] Step 3: Cleaning, put the substrate into an ultrasonic cleaner equipped with ethanol solution for cleaning for 25-30 minutes, take out the substrate, and put it into another ultrasonic cleaner equipped with ultrapure water for cleaning for 20-30 minutes;

[0026] Step 4: Spraying, pour the stirred raw materials into the spraying mechanism, start the power switch of the spraying mechanism, and the spraying mechanism will evenly spray the raw materials on the cleaned substrate;

[0027] Step 5: Drying, pu...

Embodiment 1

[0030] Include the following steps:

[0031] Step 1: Ingredients, mix 45 parts of raw materials polyvinyl formal, 20 parts of artificial protein powder colloid, and 10 parts of zinc oxide according to the ratio through an electronic scale;

[0032] Step 2: Stir, pour the raw materials prepared according to the proportion into the mixer, and stir for 35 minutes at a speed of 120 rpm;

[0033] Step 3: Cleaning, put the matrix into an ultrasonic cleaner equipped with ethanol solution for cleaning for 25 minutes, take out the matrix, and put it into another ultrasonic cleaner equipped with ultrapure water for 20 minutes;

[0034] Step 4: Spraying, pour the stirred raw materials into the spraying mechanism, start the power switch of the spraying mechanism, and the spraying mechanism will evenly spray the raw materials on the cleaned substrate;

[0035] Step 5: Drying, put the substrate with raw materials into the dryer, and dry it for 4.5 hours under the drying conditions of tempe...

Embodiment 2

[0039] Include the following steps:

[0040] Step 1: Ingredients, 68 parts of raw materials polyvinyl formal, 30 parts of artificial protein powder colloid, and 15 parts of zinc oxide are prepared according to the proportion through the electronic scale;

[0041] Step 2: Stir, pour the raw materials prepared according to the proportion into the mixer, and stir for 35 minutes at a speed of 150 rpm;

[0042] Step 3: Cleaning, put the matrix into an ultrasonic cleaner equipped with ethanol solution for 30 minutes, take out the matrix, and put it into another ultrasonic cleaner equipped with ultrapure water for 30 minutes;

[0043] Step 4: Spraying, pour the stirred raw materials into the spraying mechanism, start the power switch of the spraying mechanism, and the spraying mechanism will evenly spray the raw materials on the cleaned substrate;

[0044]Step 5: Drying, put the substrate with raw materials into the dryer, and dry it for 5.5 hours under the drying conditions of temp...

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PUM

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Abstract

The invention discloses a preparation method of a micron-sized ultrathin metal sheet for a conductive adhesive, and relates to the field of electronic components. The preparation method comprises the following steps that step 1, material preparation is carried out, 45-68 parts of polyvinyl formal, 20-30 parts of artificial protein powder colloid and 10-15 parts of zinc oxide are blended according to a proportion through an electronic scale; and step 2, stirring is carried out, the raw materials blended according to the proportion are poured into a stirrer, and stirring is carried out for 35 minutes under the condition that the rotating speed is 120-150 revolutions per minute. By arranging a spraying mechanism, a stripping machine and a stirring machine, the tedious steps of traditional manual operation are changed, so that the method for manufacturing the micron-sized ultrathin metal sheet for the conductive adhesive is simpler, the working efficiency is higher and higher, the investment of human capital is saved, and the production quality of products is improved; and meanwhile, the zinc oxide is added as one of the raw materials, so that the wear resistance and durability of the micron-sized ultrathin metal sheet for the conductive adhesive are improved.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for preparing a micron-scale ultra-thin metal sheet used for conductive adhesive. Background technique [0002] Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments. They are capacitors, transistors, The general term for electronic devices such as hairsprings and springs, common ones include diodes, etc. Electronic components include: resistors, capacitors, inductors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, lasers Components, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/00C23C14/02C23C14/20C23C14/34B05D7/14B05D3/10B05D3/02B05B16/00B05B13/04C09D129/14C09D189/00C09D7/61C09J9/02
CPCC23C14/34C23C14/205C23C14/024C23C14/0005B05D7/14B05D3/0254B05D3/102B05B16/00B05B13/0405C09D129/14C09D7/61C09J9/02B05D2518/00B05D2320/00B05D2301/00C08K2003/2296C08L89/00C08K3/22
Inventor 肖志宏
Owner 青沃精密仪器(苏州)有限公司
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