Ultrasonic magneto-rheological chemical composite polishing device and method

Abstract

The invention provides an ultrasonic magneto-rheological chemical composite polishing device. The ultrasonic magneto-rheological chemical composite polishing device comprises a rack, a cup-shaped polishing disc, a magneto-rheological tool head and an ultrasonic vibration mechanism, wherein the cup-shaped polishing disc is arranged on the rack and used for containing a working solution and placing a workpiece to be machined, and the cup-shaped polishing disc can move back and forth in the horizontal plane relative to the rack; the magneto-rheological tool head has magnetism and is used for being inserted into the working solution and acting with the working solution to enable the working solution to form a magneto-rheological grinding head; and the ultrasonic vibration mechanism comprises an ultrasonic generator, an ultrasonic transducer electrically connected with the ultrasonic generator and ultrasonic amplitude transformers arranged at the output end of the ultrasonic transducer, the ultrasonic amplitude transformers are arranged up and down, the magneto-rheological tool head is arranged at the lower ends of the ultrasonic amplitude transformers, the upper ends of the ultrasonic amplitude transformers are connected with the output end of the ultrasonic transducer, and the ultrasonic transducer is arranged on the rack in an up-down moving mode. According to the polishing device, ultrasonic high-frequency vibration, the acoustic-chemical effect and the magneto-rheological effect are combined, and therefore the polishing effect can be effectively improved.

Description

technical field [0001] The invention belongs to the field of magnetorheological processing, in particular to an ultrasonic magnetorheological composite polishing device and method. Background technique [0002] With the development of electronic information society, semiconductor materials are widely used as high-performance microelectronic components, such as single crystal silicon, aluminum oxide, strontium titanate and single crystal silicon carbide and other electronic ceramic materials are in increasing demand. Semiconductor wafers require ultra-smooth surfaces without surface defects, so the manufacture of semiconductor materials increasingly relies on grinding and polishing technology to meet their production requirements. Magneto-rheological polishing technology has the characteristics of good polishing effect, no surface damage, and suitable for complex surface processing. It is widely used in the final processing of the surface of large optical components. However,...

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Problems solved by technology

Chinese patent 201911337686.2 proposes an electro-Fenton cluster magneto-rheological compound grinding and polishing device and method. This method uses the action of an electric field to generate an electro-Fenton reaction, combined with magneto-rheological polishing for processing, but there are potential safety hazards. Higher requirements on the environment and operating specifications

Chinese patent 202011530282.8 proposes a cluster magneto-rheological ultrasonic composite polishing processing device and method. The workpiece is pasted and connected to the ultrasonic component to generate high-frequency vibration, and the high temperature rise during long-term processing may easily cause the workpiece to fall off and be damaged.

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