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Insulating heat-conducting gasket and preparation method thereof

A technology of insulating heat conduction and gasket, applied in the fields of heat conduction and heat dissipation material, heat conduction interface material and thermal management material, it can solve the problems of unsatisfactory heat conduction performance of gasket, small filling amount, increase filling difficulty, etc., and achieve low cost and high insulation. The effect of high thermal conductivity and high thermal conductivity

Pending Publication Date: 2021-09-03
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the filling amount of sheet-shaped materials in adhesives such as organic silica gel is generally small, and the larger sheet diameter will further increase the difficulty of filling, and the thermal conductivity of the final gasket is often not ideal

Method used

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  • Insulating heat-conducting gasket and preparation method thereof
  • Insulating heat-conducting gasket and preparation method thereof
  • Insulating heat-conducting gasket and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0062] Hereinafter, the preparation method of the insulating and heat-conducting gasket of the present invention will be described, which roughly includes the following steps.

[0063] Step (a): mixing two-dimensional thermally conductive fillers and polymers;

[0064] Step (b): converting the polymer into a filament by high-speed shearing or high-speed centrifugal rotation, and connecting the two-dimensional heat-conducting fillers to each other;

[0065] Step (c): adding an adhesive and fully mixing, so that the polymer filament runs through the entire system to form a network structure;

[0066] Step (d): compressing the mixture into a sheet;

[0067] Step (e): laminating the sheets formed in step (d) and pressing them into a block, and solidifying and forming;

[0068] Step (f): cutting the solidified and formed block in step (e) along the height direction of the laminated sheets to obtain several thin sheets (ie, the insulating and thermally conductive gasket of the pre...

Embodiment 1

[0078] In this embodiment, the two-dimensional sheet-shaped thermally conductive filler is boron nitride, accounting for 50wt%, the high molecular polymer is drawing grade PI, accounting for 5wt%, and the liquid silicone uses polydimethylcyclosiloxane, accounting for 50wt%. 45% by weight. In addition, the size distribution of the boron nitride sheet is in the range of 20-50 μm.

[0079] The high-molecular polymer is drawn to form a filamentary network by high-speed shearing, the shearing rate is 30000r / min, and the shearing time is 1min.

[0080] Subsequently, press to form a sheet with a thickness of 0.2 mm, and then stack several layers of sheets with the same thickness and press to form a block, and the block is cured and formed at a curing temperature of 150°C. Then, along the height direction of the layer-by-layer stacking of the aforementioned sheets, the cured and formed block was cut into several thin slices with a thickness of 1 mm to obtain the insulating and therma...

Embodiment 2

[0083] In this embodiment, the two-dimensional sheet-shaped thermally conductive filler is boron nitride, accounting for 92wt%, the high molecular polymer is drawing grade PE, accounting for 3wt%, and the liquid silicone is polydimethylsiloxane, accounting for 5wt%. . In addition, the diameter of the boron nitride sheet is 50-200 μm.

[0084] The high-molecular polymer is drawn to form a filamentary network by high-speed shearing, the shearing rate is 5000r / min; the shearing time is 15min.

[0085] Subsequently, a sheet with a thickness of 3 mm was prepared, and several layers of sheets with the same thickness were stacked and pressed into a block, and the block was solidified and formed at a curing temperature of 120° C. Then, along the height direction of the aforementioned stacked layers, the cured and formed block was cut into several slices with a thickness of 1 mm to obtain the insulating and thermally conductive gasket sample of Example 2 of the present invention.

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Abstract

The invention relates to an insulating heat-conducting gasket which comprises an insulating heat-conducting material, a high-molecular polymer and a binder. The insulating heat-conducting material is of a two-dimensional sheet-shaped structure, the two-dimensional sheet-shaped structure is oriented in the thickness direction of the insulating heat-conducting gasket, the high-molecular polymer is filamentous to connect the two-dimensional sheet-shaped structure, and finally penetrates through the interior of the insulating heat-conducting gasket; a two-dimensional heat-conducting filler is selected from at least one of boron nitride, aluminum nitride and silicon carbide.

Description

technical field [0001] The invention relates to the fields of heat conduction and heat dissipation materials, heat conduction interface materials, heat management materials and the like. Background technique [0002] In electronic devices such as 5G base stations, notebook computers, and high-power LED displays, radiators are required to dissipate the heat generated by heating elements in time to ensure the stability of electronic devices. In most cases, a thermal pad is required between the heating element and the heat sink to reduce the interface thermal resistance. With the substantial increase in the power of electronic devices, ordinary thermal pads (thermal conductivity generally below 10W / (m·K)) are far from meeting the heat dissipation requirements. [0003] Patent document CN109891578A discloses a thermally conductive gasket in which high thermally conductive carbon fibers are vertically arranged as the main thermally conductive filler, and its thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L79/08C08K7/00C08K3/38C08L23/06C08L23/12C08K3/28C08L25/06C08L77/00C08L83/08C08K3/34C08L27/18C08L67/02C08L55/02C08L27/16C09K5/14H05K7/20H01B19/00H01B17/56
CPCC08L83/04C08L83/08C09K5/14H05K7/2039H01B17/56H01B19/00C08K2003/385C08K2003/282C08L79/08C08K7/00C08K3/38C08L23/06C08L23/12C08K3/28C08L25/06C08L77/00C08K3/34C08L27/18C08L67/02C08L55/02C08L27/16
Inventor 葛翔石燕军李峰李壮周步存
Owner CHANGZHOU FUXI TECH CO LTD
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