High-thermal-conductivity semi-cured adhesive film of metal substrate and preparation method of high-thermal-conductivity semi-cured adhesive film

Abstract

The invention discloses a high-thermal-conductivity semi-cured adhesive film of a metal substrate, which is characterized by comprising the following components in parts by weight: 100 parts of epoxy resin, 16-24 parts of heat-conducting filler, 20-50 parts of a curing agent and 3-9 parts of a curing agent accelerator, wherein the heat-conducting filler is modified boron nitride / tantalum disilicide microspheres. The semi-cured adhesive film is obtained by mixing the epoxy resin and the heat-conducting filler and then curing the mixture through a curing agent, wherein the heat-conducting filler uses boron nitride as a base material, modification is carried out on the basis of boron nitride, then the modified boron nitride and tantalum disilicide are combined to form microspheres, functional groups on the surface of the modified boron nitride and tantalum disilicide can generate microspheres under the action of a salt template and polyvinyl alcohol, the formed microspheres have larger specific surface area and certain flexibility, and the mechanical properties and toughness of the epoxy resin can be enhanced while the thermal conductivity of the epoxy resin is improved.

Description

technical field [0001] The invention relates to the field of metal substrates, in particular to a high thermal conductivity semi-cured adhesive film of a metal substrate and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of light, thin, short, small, high-density and multi-functional, the assembly density and integration of components on the circuit board are getting higher and higher, and the heat dissipation requirements of the substrate are becoming more and more urgent. In the traditional circuit board structure, due to the small number and power consumption of electronic components inserted on it, the heat generated by the electronic components can be dissipated through the copper foil layer on the circuit board, and the heat can be dissipated directly into the air. Convection controls the temperature of electronic components. The electronic components of today's circuit boards have high power and...

AI Technical Summary

Problems solved by technology

The high thermal conductivity semi-cured adhesive film is composed of resin that provides bonding and inorganic fillers with high thermal conductivity, etc. Therefore, it is possible to make it into an insulating and heat-dissipating adhesive layer for the substrate, but because the adhesive film has no support reinforcement materials, and most of the existing ones use epoxy resin as the main body. The glue is easier to tear after forming a film, and it is more prone to embrittlement after being placed for more than a week after the film is formed. The degree of embrittlement accelerates with the increase of temperature.

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