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Polyether modified epoxy resin conductive adhesive and preparation method thereof

A technology of epoxy resin and polyether modification

Active Publication Date: 2021-09-14
北京中天鹏宇科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a polyether modified epoxy resin conductive adhesive and its preparation method to solve the technical problems of poor thermal conductivity and heat resistance of the conductive adhesive in the prior art

Method used

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  • Polyether modified epoxy resin conductive adhesive and preparation method thereof
  • Polyether modified epoxy resin conductive adhesive and preparation method thereof
  • Polyether modified epoxy resin conductive adhesive and preparation method thereof

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preparation example Construction

[0041] The present invention also provides a method for preparing the above-mentioned polyether modified epoxy resin conductive adhesive, the preparation method comprising:

[0042] 1) The epoxy resin, polyether phosphate modified epoxy resin, toughening agent, curing agent, curing accelerator, coupling agent, thixotropic agent and diluent are subjected to ultrasonic dispersion and vacuum defoaming treatment in sequence to obtain matrix resin;

[0043] 2) The conductive filler and the matrix resin are sequentially mixed, ground, and planetary degassed to prepare the polyether modified epoxy resin conductive adhesive.

[0044] Among them, ultrasonic dispersion treatment can improve the dispersibility of components; planetary defoaming treatment can effectively remove air bubbles in the conductive adhesive, thereby avoiding the occurrence of air bubbles in the conductive adhesive during use.

[0045] In the above preparation method, the dosage of each material component and the...

Embodiment 1

[0083] 1) Mix 50g of polyether polyol-1 and 1.8g of polyphosphoric acid, stir well, react at 80°C for 5h, add 5mL of water, stir and hydrolyze at 80°C for 3h, and purify to obtain polyether phosphate. Weigh 2g of the above polyether phosphate and 20g of NPEL-128 epoxy resin into a three-necked flask, stir mechanically, and react at 80°C for 1 hour to obtain a polyether phosphate modified epoxy resin.

[0084] 2) 1.5 g of polyether phosphate modified epoxy resin, 2 g of NPEL-128 epoxy resin, 1.7 g of TDE-85 epoxy resin, 1 g of core-shell toughening agent-1, Hydrogen phthalic anhydride 5g, 0.04g imidazole accelerator-1, 0.06g silane coupling agent-1, thixotropic agent fumed silica 0.1g, thinner dibasic acid ester 4g, mix and stir evenly, ultrasonically disperse for 10min ( After the ultrasonic frequency is 40KHz), vacuum defoaming treatment (vacuum degree is -0.093MPa, treatment time is 30min) is carried out to obtain the matrix resin.

[0085]3) Add 88g of mixed silver powder ...

Embodiment 2

[0087] 1) Mix 50g of polyether polyol-2 and 0.5g of phosphorus pentoxide, stir well, react at 90°C for 4h, add 3mL of water, stir and hydrolyze at 70°C for 2h, and purify to obtain polyether phosphate. Weigh 1g of the above polyether phosphate and 20g of NPEL-128 epoxy resin into a three-necked flask, stir mechanically, and react at 80°C for 1.5h to obtain a polyether phosphate modified epoxy resin.

[0088] 2) 2.2g of polyether phosphate modified epoxy resin, 1.9g of NPEL-128 epoxy resin, 1.5g of TDE-85 epoxy resin, 0.9g of carboxy-terminated nitrile rubber, cis-6 4.8g of hydrophthalic anhydride, 0.04g of imidazole accelerator-2, 0.06g of silane coupling agent-2, 0.1g of thixotropic agent organobentonite, and 3.5g of thinner ethylene glycol butyl ether acetate were mixed and stirred evenly, and after ultrasonic dispersion for 10min ( Ultrasonic frequency is 40KHz), vacuum defoaming treatment (vacuum degree is -0.095MPa, treatment time is 25min) to obtain matrix resin.

[008...

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Abstract

The invention discloses a polyether modified epoxy resin conductive adhesive and a preparation method thereof. The polyether modified epoxy resin conductive adhesive is prepared from, by weight, 3 to 7 parts of epoxy resin, 70 to 90 parts of a conductive filler, 1.5 to 3.5 parts of polyether phosphate modified epoxy resin, 0.5 to 2.5 parts of a flexibilizer, 4 to 9 parts of a curing agent, 0.03 to 0.1 part of a curing accelerator, 0.05 to 0.2 part of a coupling agent, 0.1 to 0.5 part of a thixotropic agent and 1 to 5 parts of a diluent. The curing agent is a liquid anhydride curing agent. The polyether modified epoxy resin conductive adhesive solves the technical problems of poor heat conduction and heat resistance of the conductive adhesive in the prior art.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a polyether modified epoxy resin conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying; it can connect various conductive materials together, so that an electrical path is formed between the connected materials. In the electronics industry, conductive adhesive has become an essential new material. General conductive adhesives only have certain requirements on the conductivity and bonding strength of conductive adhesives. In addition to certain requirements on electrical conductivity and bonding strength, special conductive adhesives also have certain special requirements, such as high temperature resistance, ultra-low temperature resistance, instant Curing, anisotropy and transparency, etc. [0003] LED is widely used in lighting and display fields due to its advantages of h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/08C08G59/42C08G81/00
CPCC09J9/02C09J163/00C09J11/08C08G59/42C08G81/00C08K2003/0806C08K2201/005C08L2205/035C08L2205/025C08L2203/206C08L87/005C08K13/04C08K7/00C08K3/08C08K7/18C08K13/06
Inventor 刘昊朱舒燕武瑞清雪丹
Owner 北京中天鹏宇科技发展有限公司
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