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Organic silicon heat-conducting pouring sealant and preparation method thereof

A heat-conducting potting, silicone technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor defoaming, brittleness, loss of elasticity, etc., to improve hardness and tensile ability , The effect of improving curing performance and good fluidity

Active Publication Date: 2021-09-17
上海珏晟新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Silicone thermally conductive potting adhesives on the market are mainly realized by adding a large amount of thermally conductive fillers. However, due to the addition of a large amount of thermally conductive fillers, the fluidity of the thermally conductive adhesive is affected, and the defoaming property is poor. There are bubbles in the cured rubber block, which is extremely large. The thermal conductivity of the thermally conductive adhesive is greatly reduced, but without adding a large amount of thermally conductive filler, the thermal conductivity of the thermally conductive adhesive will also be affected, resulting in a contradictory situation
In addition, due to the addition of a large amount of thermally conductive fillers, the glue is easy to settle during storage, and the hardness of the glue is high after curing, and it is brittle and loses its original elasticity.

Method used

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  • Organic silicon heat-conducting pouring sealant and preparation method thereof
  • Organic silicon heat-conducting pouring sealant and preparation method thereof
  • Organic silicon heat-conducting pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0028] Table 1 shows the parts by weight of each component of the silicone thermal conductive potting compound in Examples 1-5.

[0029] The parts by weight of each component of the silicone thermal conductive encapsulant in Table 1 Examples 1-5

[0030]

[0031]

[0032] In Examples 1-5, the vinyl content in the vinyl terminated silicone oil is 0.1-1%; the mesh number of spherical alumina A is 200-300 mesh, and the mesh number of spherical alumina B is 2000-2500 mesh; silicon carbide The mesh number of aluminum hydroxide is 300-500 mesh; the mesh number of aluminum hydroxide is 1000-2000 mesh; the silane coupling agent is methyltrimethoxysilane; The hydrogen content of the silicone oil is 0.1-0.5%; the platinum catalyst is a platinum(0)-divinyltetramethyldisiloxane complex with a platinum content of 5000ppm.

[0033] The preparation method of the silicone thermal conductive potting compound in the embodiment 1-5 comprises the following steps:

[0034] S1. Mix the viny...

Embodiment 6-10

[0037] Table 2 shows the parts by weight of each component of the silicone thermal conductive encapsulant in Examples 6-10.

[0038] The parts by weight of each component of the silicone thermal conductive encapsulant in Table 2 Examples 6-10

[0039]

[0040]

Embodiment 6

[0042] The preparation method of the silicone thermal conductive potting compound in the embodiment 6 comprises the following steps:

[0043] S1. After mixing the vinyl-terminated silicone oil, spherical alumina A, silicon carbide, aluminum hydroxide and silane coupling agent, place it in an environment with a vacuum degree of -0.1--0.09MPa and 160°C, and stir and mix for 4 hours to obtain a mixture ;

[0044] S2. Pour in cooling water, stir and cool the mixture to 50°C, and divide it into material A and material B evenly. After adding platinum catalyst to material A, stir and mix through a 100-mesh sieve for packaging, and add end of material to material B. After the hydrogen-containing silicone oil, the side-containing hydrogen-containing silicone oil and acetylene cyclohexanol are stirred and mixed, pass through a 100-mesh sieve for packaging.

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Abstract

The invention relates to the technical field of electronic packaging adhesives, and particularly discloses an organic silicon heat-conducting pouring sealant and a preparation method thereof. The pouring sealant is prepared by polymerizing the following raw materials in parts by weight: 10-25 parts of vinyl-terminated silicone oil; 60-95 parts of a heat-conducting filler; 1-3 parts of a silane coupling agent; 8-16 parts of hydrogen-containing silicone oil; 0.1 to 0.5 part of a platinum catalyst; and 0.00005 to 0.001 part of acetylene cyclohexanol. The preparation method comprises the following preparation steps: S1, mixing the vinyl-terminated silicone oil, the heat-conducting filler and the silane coupling agent, putting the mixture in an environment with the pressure of-0.1 to-0.09 MPa and the temperature of 150-160 DEG C, and stirring and mixing for 3-5 hours to obtain a mixture; and S2, stirring and cooling the mixture to 40-60 DEG C, dividing the mixture into a material A and a material B, adding the platinum catalyst into the material A, stirring and mixing, sieving with a 100-mesh sieve for sub-packaging, adding the hydrogen-containing silicone oil and the acetylene cyclohexanol into the material B, stirring and mixing, sieving with a 100-mesh sieve for sub-packaging. The pouring sealant can be used in the electronic and electric appliance packaging industry, the new energy vehicle battery packaging industry and the like.

Description

technical field [0001] The present application relates to the technical field of electronic encapsulation adhesives, and more particularly, to a silicone thermal conductive encapsulation adhesive and a preparation method thereof. Background technique [0002] Electronic encapsulant is used for bonding, sealing, potting and coating protection of electronic components. The electronic encapsulant is liquid before curing and has fluidity. The viscosity of the glue depends on the material and performance of the electronic encapsulant. , The production process is different. The potting compound can only realize its use value after it is completely cured. [0003] There are many types of electronic encapsulation adhesives. In terms of material types, the most commonly used are mainly three types, namely epoxy resin encapsulant, silicone resin encapsulant and polyurethane encapsulant. Among them, some functional fillers can be added to the silicone resin encapsulant to give itself...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04
CPCC09J183/04C09J11/04C08K2003/2227C08L2203/206C08L83/04C08K9/06C08K7/18C08K3/34C08K3/22
Inventor 陈辉
Owner 上海珏晟新材料科技有限公司
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