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Thick-film resistor paste with low size effect

A thick film resistor and paste technology, applied in thick film resistors, resistors, conductive materials dispersed in non-conductive inorganic materials, etc. Resistance deviation, etc.

Active Publication Date: 2021-10-01
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing thick film resistor paste has a high size effect, and when it is applied to an integrated circuit, there will be a problem that the resistance value of the resistor after printing different patterns will have a large deviation, which will cause trouble to the integrated circuit design process; when applied to a chip resistor Among them, the resistance values ​​of resistors of different specifications vary greatly, and chip resistor manufacturers need to select and adjust the resistor paste for resistors of different specifications, which causes inconvenience in production management

Method used

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  • Thick-film resistor paste with low size effect
  • Thick-film resistor paste with low size effect
  • Thick-film resistor paste with low size effect

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0079] Preparation Example 1: Preparation of Glass Powder

[0080] The raw material of glass powder A is 45wt% Pb 3 O 4 , 28wt% CaO, 23wt% SiO 2 and 4wt% B 2 O 3 , the raw material of glass frit B is 65wt% Pb 3 O 4 , 20wt% SiO 2 and 15wt% B 2 O 3 , after the glass powder raw materials are mixed uniformly, the obtained mixture is placed in a smelting furnace at 1350 ° C for smelting, the holding time is 1.5h, the obtained glass solution is water quenched to obtain glass, the glass is broken into glass slag, and the glass slag is Grind with a ball mill to a particle size of 1.5 μm, and dry to obtain glass powder A and glass powder B.

preparation example 2

[0081] Preparation Example 2: Preparation of Additives

[0082] CuO and MnO with a particle size of 1.5 μm 2 Mix uniformly according to the mass ratio of 1:1, as the additive used in Examples 1-6 and Comparative Examples 1-6.

preparation example 3

[0083] Preparation Example 3: Preparation of Organic Carrier

[0084] After stirring and heating 65g terpineol and 3g soybean lecithin to 70°C in a beaker, add 8g of ethyl cellulose and continue to stir to dissolve completely, then add 24g of butyl carbitol acetate, keep stirring for 30 minutes to obtain the implementation. Organic vehicles used in Examples 1-6 and Comparative Examples 1-6.

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Abstract

The invention discloses thick-film resistor paste with a low size effect. The thick-film resistor paste comprises a functional material, glass powder, light-burned mullite, dolomite, an organic carrier and an optional additive. According to the invention, the light-burned mullite and the dolomite are introduced to optimize the graphic effect after the resistor is sintered, so that the resistor has the advantage that the graphic effect is not obvious, and the use requirements of thick film integrated circuits with different graphic sizes and chip resistor products with different specifications can be met.

Description

technical field [0001] The invention belongs to the field of electronic paste, in particular to a thick film resistor paste with low size effect. Background technique [0002] Thick film resistor paste is a technology-intensive product integrating metallurgy, chemistry, materials, electronic technology, analysis and testing technology and other multidisciplinary fields. To accommodate printing, sintering process requirements and practical application requirements, resistor pastes must have printability, functional properties and process compatibility. The commonly used resistance paste is a paste that is mixed with functional phase, binder phase, additives and organic carrier in a certain proportion. [0003] Thick film resistor paste is used as a raw material for the production of thick film integrated circuits and chip resistors. The paste is required to have a wide resistance range of 0.1Ω to 10MΩ, which can meet the requirements of integrated circuit and chip resistor p...

Claims

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Application Information

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IPC IPC(8): H01B1/14H01B1/16H01B1/20H01B1/22H01C7/00H05K1/09
CPCH01B1/14H01B1/16H01B1/20H01B1/22H01C7/003H05K1/092
Inventor 鹿宁赵科良吴高鹏殷美党丽萍王妮孙社稷何依青
Owner 西安宏星电子浆料科技股份有限公司
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