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Film-like adhesive, adhesive sheet and semiconductor device

A technology for semiconductors and adhesives, which is applied in the manufacture of film/sheet adhesives, semiconductor devices, semiconductor/solid-state devices, etc., and can solve problems such as inability to obtain sufficient HAST resistance, high probability, and electrical signal loss

Pending Publication Date: 2021-10-01
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even in this case, sometimes the loss of electrical signals caused by copper ions generated from the lead frame becomes a problem
[0005] In addition, in a semiconductor package using a component made of copper, copper ions are generated from the component, which may cause electrical failure and may not be able to obtain sufficient HAST resistance.

Method used

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  • Film-like adhesive, adhesive sheet and semiconductor device
  • Film-like adhesive, adhesive sheet and semiconductor device
  • Film-like adhesive, adhesive sheet and semiconductor device

Examples

Experimental program
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Effect test

preparation example Construction

[0047] The solvent used in the preparation of the adhesive varnish is not limited as long as it can dissolve, knead or disperse the components uniformly, and conventionally known solvents can be used. Examples of such solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl ethyl ketone, and cyclohexanone, dimethylformamide, dimethylacetamide, N-methyl-2- Pyrrolidone, toluene, xylene, etc. The solvent may be methyl ethyl ketone, cyclohexanone or the like from the viewpoint of fast drying speed and low price.

[0048] As a method of applying the adhesive varnish to the support film, a known method can be used, for example, a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, etc. . The conditions of heat drying are not particularly limited as long as the solvent used can be sufficiently volatilized, and it can be performed by heating at 50 to 150° C. for 1 to 30 mi...

Embodiment 1、 Embodiment 2 and comparative example 1

[0089] [Production of film adhesive]

[0090]

[0091] The acrylic rubber solutions shown in Table 1 were used as adhesive varnishes. In addition, the numerical value shown in Table 1 means the mass part of the solid content of an acrylic rubber solution.

[0092] (A) Ingredient: Acrylic rubber

[0093] (A1) Acrylic rubber A: SG-P3 solvent-modified product (substance obtained by changing the solvent of SG-P3 (trade name, manufactured by Nagase Chemtex Corporation, methyl ethyl ketone solution of acrylic rubber)), derived from acrylonitrile Constituent unit: yes, weight average molecular weight: 700,000, measured Tg: 12°C, solvent: cyclohexanone

[0094] (A2) Acrylic rubber B: structural unit derived from acrylonitrile: yes, weight average molecular weight: 700,000, measured Tg: 22°C, solvent: cyclohexanone

[0095] (A3) Acrylic rubber C: structural unit derived from acrylonitrile: none, weight average molecular weight: 500,000, measured Tg: 20°C, solvent: cyclohexanone

...

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Abstract

Disclosed is a film-like adhesive for adhering a semiconductor device and a support member on which the semiconductor device is mounted. The film-like adhesive contains an acrylic rubber. The acrylic rubber satisfies either of the following conditions (i) or (ii). Condition (i): the acrylic rubber has a constitutional unit derived from acrylonitrile and has a glass transition temperature (Tg) over 12 DEG C. Condition (ii): The acrylic rubber has no constitutional unit derived from acrylonitrile and has a glass transition temperature (Tg) of at least 0 DEG C.

Description

technical field [0001] The invention relates to a film adhesive, an adhesive sheet and a semiconductor device. Background technique [0002] In recent years, stacked MCPs (Multi Chip Packages) in which semiconductor elements (semiconductor chips) are stacked in multiple layers have spread, and are mounted as memory semiconductor packages for mobile phones and portable audio equipment. In addition, along with the multifunctionalization of mobile phones and the like, the speed, density, and integration of semiconductor packages are also advancing. Along with this, an increase in speed has been achieved by using copper as a wiring material for semiconductor chip circuits. Furthermore, from the viewpoint of improving connection reliability with complicated mounting substrates and promoting heat dissipation from semiconductor packages, lead frames and the like made of copper are increasingly used. [0003] However, since copper is easily corroded and from the viewpoint of cost ...

Claims

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Application Information

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IPC IPC(8): C09J119/00C09J133/04C09J133/20H01L21/52H01L21/301C09J7/20C09J7/30
CPCC09J133/20C09J7/30C09J7/20H01L21/52C09J133/04C09J119/00H01L2224/73265H01L2224/32145H01L2224/32225H01L2924/181H01L2224/48091H01L2224/48227H01L2924/00012H01L2924/00014H01L2924/00C09J7/38C09J2203/326
Inventor 孙晓寅伏木贵法中山纪行国土由衣中村奏美桥本慎太郎谷口纮平
Owner 株式会社力森诺科
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