Device and method for femtosecond laser processing nozzle tangential hole

Abstract

The invention provides a femtosecond laser processing device and method for nozzle tangential hole, which relates to the field of laser precision processing. Computer, CNC three-axis motion platform, vacuuming device, fixture, filter system, sealing tube, pressure gauge and vacuum pump; the principle of this technical solution is to use circularly polarized femtosecond laser with flat top light distribution to make nozzle tangential holes The uniform and precise processing of the machine is achieved through the protective block in the fixture to achieve back injury protection at the exit of the tangential hole. The negative pressure generated by the vacuum pump can not only monitor the breakdown of the hole, but also avoid the generated plasma to the laser. shielding. The invention can effectively improve the machining accuracy of the current nozzle tangential hole, avoid the defects of recast layer and thermal influence, and propose a solution for back injury protection, which is helpful to improve the liquid flow performance of the nozzle product.

Description

technical field [0001] The invention belongs to the field of laser precision machining, and in particular relates to a device and method for femtosecond laser machining nozzle tangential holes. Background technique [0002] As a typical and important component of combustion equipment, nozzles are widely used in chemical industry, automobile industry, aerospace and other fields. Among them, the working principle of the centrifugal nozzle is that the liquid generates a swirl movement through the tangential hole under the action of pressure, and finally rotates and ejects in the form of a conical liquid film. Therefore, the manufacturing of the tangential hole of the nozzle is very important. The machining accuracy and surface quality of the tangential hole will significantly affect the flow characteristics, atomization characteristics and service life of the nozzle, thereby further reducing the performance and quality of the applied products. Especially in the application of ...

AI Technical Summary

Problems solved by technology

First of all, there are burrs in the hole of the mechanical drilling, the rigidity of the micro-drill is poor, it is easy to deflect, and there is difficulty in chip removal

The EDM electrode wire is easily disturbed, and the surface has a recast layer and spatter adhesion, resulting in poor sidewall roughness

Nanosecond laser processing also has molten splash and recasting layer, the heat-affected zone is obvious, the processed hole has obvious taper, the diameter difference between the entrance and exit is large, and it is difficult to avoid damage to the rear wall during processing

These processing quality problems are likely to cause liquid flow jitter and bifurcation, reduce atomization performance, and even cause key components to fail and fail to work normally

[0004] It can be seen that the tangential holes of nozzles manufactured by existing industrial processing methods inevitably have certain deficiencies, which will limit the reliability and performance improvement of related products in our country, and gradually become difficult to meet the country's design and use requirements for high-performance nozzles.

Images