Copper-clad plate base material

Abstract

The invention relates to a copper-clad plate base material which comprises the following components in percentage by weight: 60%-80% of phenolic resin, 9%-15% of epoxy resin, 8%-10% of a solvent and 10%-20% of a flame retardant. The flame retardant comprises diphenyl tolyl phosphate, chlorinated paraffin and epoxidized soybean oil. The flame retardant comprises 30-85% of the diphenyl tolyl phosphate, 0-60% of the chlorinated paraffin and 0-10% of the epoxidized soybean oil. The novel flame retardant is added into the copper-clad plate base material, so that the overall performance of a copper-clad plate product is improved, the electrical performance, the soldering resistance and the heat resistance are obviously improved, the defect of batch pattern cards is improved, the trimming of the product is smooth, and the punching effect is good.

Description

technical field [0001] The invention relates to a test device, in particular to a basic material of a copper clad laminate. Background technique [0002] Copper clad laminate products directly act as substrate materials in the production process of printed circuit boards. Printed circuit boards are widely used in computer, communication, consumer motor, industrial / medical, military, semiconductor and automotive industries, involving almost all electronic information products; Among them, computers, communications and consumer electronics are the three main application areas, accounting for about 70% of the output value of the PCB industry. [0003] In the entire PCB industry chain, the cost of CCL accounts for more than 30% of the PCB industry. In recent years, the application fields of paper-based and glass fiber-based CCL have continued to expand, and the production volume has increased rapidly. In order to reduce the cost of the PCB industry and meet the continuous improv...

AI Technical Summary

Problems solved by technology

[0009] 1. The gel time is too long and the curing time is slow, which affects the drying speed;

[0010] 2. The prepreg should not be stored. The aging of the adhesive tape will occur after the storage period at room temperature exceeds 24 hours. Continuous production will cause batches of flakes to appear on the sheet;

[0011] 3. The finished product is prone to thermal deformation and warping in the downstream PCB process, which affects the efficiency of automated production;

[0012] 4. During the punching operation of the process PCB, because the material is not flexible enough, punching is prone to poor appearance such as plate cracks, powder falling, and copper skin drumming;

[0013] 5. The CAF resistance performance of the downstream PCB becomes worse during welding or etching

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