An electrochemical high-precision polishing method for metal microstructures

Abstract

The invention discloses an electrochemical high-precision polishing method of metal microstructure, which comprises the following steps: preparing a solid electrolyte wrapped with a structural surface of a metal workpiece to be polished; polishing and electrolyzing the metal workpiece; removed from the solid electrolyte. The present invention utilizes the property that the solid electrolyte can be transformed into a liquid state or prepared by solution solidification under certain conditions, and can carry out self-adaptive filling of microstructures and three-dimensional structure and shape constraints of polishing electrolytes. The key to high-precision polishing of the structure, because the shape of the electrolyte is constrained, the removal of the metal material only occurs at the interface of the metal and the solid electrolyte. As the processing progresses, the separation of the metal surface and the solid electrolyte occurs, and the electrochemical corrosion of the metal occurs. Immediately stopped, the three-dimensional structure of the metal microstructure is well maintained, high-precision polishing is achieved, and certain waviness features can be removed.

Description

technical field [0001] The invention relates to polishing of metal microstructures, in particular to an electrochemical high-precision polishing method of metal microstructures. Background technique [0002] The peculiar shape characteristics of the microstructured surface make it have some specific physical and chemical functions. Micro-miniature devices with three-dimensional metal microstructures have been increasingly widely used in biomedical, precision machinery, aerospace, national defense, communications and other fields due to their functionality. For example, using the micro-slot structure in the cooling and heat dissipation system can improve the heat dissipation performance and heat dissipation efficiency; the traveling wave tube relies on its internal periodic micro-slot structure to exchange energy between electron beams and high-frequency electromagnetic traveling waves to achieve microwave signal amplification. and many more. The surface roughness of the mi...

AI Technical Summary

Problems solved by technology

[0009] 1. The electrochemical polishing method is affected by the difficulty of mass transfer in the cavity of the microstructure and the uneven distribution of the electric field intensity throughout the microstructure, resulting in inconsistent removal rates throughout the microstructure, resulting in damage to the three-dimensional shape, especially the destruction of the step shape , and the traditional electrochemical polishing can only reduce the surface roughness, and has no ability to improve the waviness

[0010] 2. The mechanical polishing method of designing and manufacturing special polishing tools using macroscopic mechanical force has poor accessibility to the microstructure cavity with a large aspect ratio, poor adhesion between the polishing tool and the microstructure surface, and possible embedding and residue of abrasive particles. It is easy to cause problems such as damage to the shape of the three-dimensional structure of the microstructure

[0011] 3. The high-energy beam polishing method is expensive in equipment, high in cost, expensive in polishing costs, and the uniformity of the focused high-energy beam intensity on the processed surface is not easy to guarantee, and it has high requirements for detection technology and precision control technology in the polishing process. Using high-energy beams to polish metal Microstructuring is an expensive and difficult process

[0012] Therefore, there is no low-cost, simple-to-operate, high-precision polishing method for metal microstructure polishing that can maintain the original three-dimensional structure shape and reduce roughness and waviness.

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