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High-heat-dissipation ink and preparation method thereof

A high heat dissipation and ink technology, applied in ink, household utensils, applications, etc., can solve problems affecting the optical performance of PCB boards, ink adhesion, ink peeling, etc., achieve good reactivity, prevent heat accumulation, and prevent peeling and cracking Effect

Pending Publication Date: 2021-11-05
FOSHAN ONMILLION NANO MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] A layer of ink usually needs to be coated on the PCB board to meet the optical requirements. However, when the PCB board is applied to products with high heat generation, such as display screens, the adhesion of the ink is often affected due to heat accumulation, resulting in ink loss. Peeling, foaming, etc., affect the overall optical performance of the PCB board

Method used

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  • High-heat-dissipation ink and preparation method thereof

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preparation example Construction

[0049] Correspondingly, the present invention also provides the preparation method of above-mentioned high heat dissipation ink, comprises the following steps:

[0050] Step S1, stirring the solvent for 15-20 minutes, the speed is 800-1200 rpm, the temperature is 50-80°C, and the pressure is normal pressure to obtain the stirred solvent;

[0051] Step S2. Slowly add filler, dispersant, and catalyst to the stirred solvent, stir for 5-15 minutes at a speed of 800-1200 rpm, a temperature of 50-80°C, and a pressure of normal pressure to obtain a mixed solution A;

[0052]Step S3, after adding the modified epoxy glue into the mixed liquid A, then add the defoamer, and stir for 5-10 minutes, the speed is 700-1000 rpm, the temperature is 40-70°C, and the pressure is normal pressure to obtain the mixed Liquid B;

[0053] Wherein, the preparation method of described modified epoxy glue comprises the following steps:

[0054] Step S31, add phthalic anhydride and polyether polyol into ...

Embodiment 1

[0063] This embodiment provides a high heat dissipation ink, and its preparation raw materials include: 30 parts of modified epoxy glue, 15 parts of solvent, 10 parts of curing agent, 10 parts of filler, 0.5 part of catalyst, 0.5 part of dispersant, and 2 parts of defoamer and 0.1 parts of carbon nanotubes;

[0064] Wherein, the modified epoxy glue comprises epoxy resin and B glue, and the volume of the epoxy resin accounts for 20% of the volume of the modified epoxy glue;

[0065] The acid value of the B glue is 113mgKOH / g, and its preparation raw materials include 25 parts of phthalic anhydride, 65 parts of polyether polyols and 15 parts of propylene glycol methyl ether acetate;

[0066] The solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

[0067] The filler includes nano barium sulfate and nano silicon dioxide, and the weight of the nano barium sulfate is 50% of the total weight of the filler.

[0068] The catalyst is toluenesulfoni...

Embodiment 2

[0079] This embodiment provides a high heat dissipation ink, its preparation raw materials include: 50 parts of modified epoxy glue, 25 parts of solvent, 20 parts of curing agent, 20 parts of filler, 3 parts of catalyst, 1 part of dispersant, 7 parts of defoamer and 2 carbon nanotubes;

[0080] Wherein, described modified epoxy glue comprises epoxy resin and B glue, and the volume of described epoxy resin accounts for 50% of the volume of described modified epoxy glue;

[0081] The acid value of the B glue is 110mgKOH / g, and its preparation raw materials include 35 parts of phthalic anhydride, 75 parts of polyether polyols and 35 parts of propylene glycol methyl ether acetate;

[0082] The solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

[0083] The filler includes nano-barium sulfate and nano-silicon dioxide, and the weight of the nano-barium sulfate is 60% of the total weight of the filler.

[0084] The catalyst is toluenesulfonic ac...

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Abstract

The invention discloses high-heat-dissipation ink which is prepared from the following raw materials in parts by weight: 30-50 parts of modified epoxy glue, 15-25 parts of a solvent, 10-20 parts of a curing agent, 10-20 parts of filler, 0.5-3 parts of a catalyst, 0.5-1 part of a dispersing agent, 2-7 parts of a defoaming agent and 0.1-2 parts of carbon nanotubes. The modified epoxy glue at least comprises epoxy resin, and the volume of the epoxy resin accounts for 20-50% of the volume of the modified epoxy glue. The solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate. The filler at least comprises nano barium sulfate. Correspondingly, the invention also provides a preparation method of the high-thermal-conductivity ink. The high-heat-dissipation ink obtained through the proportion is obtained through mutual reaction of various raw materials and is high in adhesive force and chemical resistance, and by adding the filler, the wear resistance of the ink is improved on the premise that the optical performance of the ink is not affected.

Description

technical field [0001] The invention relates to the technical field of circuit board coating, in particular to a high heat dissipation ink, and correspondingly, also relates to a preparation method of the ink. Background technique [0002] With the widespread application of electronic information, PCB boards are widely used in various equipment. The main function of PCB boards is to install various electronic components. When they are used in display screens and other fields, they are required to have high heat dissipation performance. and optical performance. [0003] A layer of ink usually needs to be coated on the PCB board to meet the optical requirements. However, when the PCB board is applied to products with high heat generation, such as display screens, the adhesion of the ink is often affected due to heat accumulation, resulting in ink loss. Peeling, foaming, etc., affect the overall optical performance of the PCB board. Contents of the invention [0004] The te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/03
CPCC09D11/102C09D11/03
Inventor 苗磊陈焰胡广齐郑明东冼慧敏
Owner FOSHAN ONMILLION NANO MATERIALS
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