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Copper electroplating wetting agent and application thereof

A copper electroplating and wetting agent technology, which is applied in the field of copper electroplating wetting agent, can solve the problems of affecting product quality and inability to remove fine bubbles, so as to improve the quality of electroplating and eliminate pinholes

Inactive Publication Date: 2021-11-09
珠海市板明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the existing wetting agent for electroplating can only wet the surface of the substrate, but cannot remove fine air bubbles, and pinholes will be formed on the coating during electroplating, which will affect product quality

Method used

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  • Copper electroplating wetting agent and application thereof

Examples

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Effect test

Embodiment 1

[0040] Humectant in an electroplating of copper, by the mass fraction of the concentration and composition: propylene glycol, 1g / L, sodium lauryl sulfate 3g / L, Tween-80 0.5% oxalic acid 0.5%, triethanolamine 0.5%, with the balance to ionized water.

Embodiment 2

[0042] Humectant in an electroplating of copper, by the mass fraction of the concentration and composition: 2% ethanol, sodium lauryl sulfate 2g / L, 1% Tween-80, 0.5% sodium thioglycolate, 1.5% triethanolamine, the balance being Deionized water.

Embodiment 3

[0044] Humectant in an electroplating of copper, by the mass fraction of the concentration and composition: glycerol 1g / L, butyl naphthalene sulfonic acid 3g / L, Span -60 0.5%, 1.5% oxalic acid, diethanolamine 0.5%, the balance being deionized water.

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PUM

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Abstract

The invention discloses a copper electroplating wetting agent and application thereof, and relates to the technical field of printed circuit board production. The wetting agent comprises the following components including any one of propylene glycol with the concentration of 1-3 g / L, glycerol with the concentration of 1-3 g / L or ethanol with the mass fraction of 2%-5%, sodium butyl naphthalene sulfonate with the concentration of 3-6 g / L or lauryl sodium sulfate with the concentration of 2-4 g / L, a nonionic surfactant with a mass fraction of 0.5%-2%, a polymer inhibitor with a mass fraction of 0.5%-2%, a wetting material with a mass fraction of 0.5%-2% and the balance deionized water. According to the copper electroplating wetting agent provided by the invention, through compounding of several materials, the surface tension or interfacial tension of a substrate can be reduced, and water can be spread on the surface of the substrate or permeate into the surface of the substrate, so that the substrate is more easily soaked by water. The copper electroplating wetting agent provided by the invention can be added into an electroplating solution according to a certain proportion, so that gas generated by electroplating can rapidly escape, the generation of pinholes is reduced or eliminated, and the electroplating quality is improved.

Description

Technical field [0001] The present invention relates to the production of printed circuit board technology, and particularly relates to an electroplating of copper wetting agent and its application. Background technique [0002] Is the principle by electrolytic plating on the surface of certain metal or metal alloy plated procedure of a thin layer, by controlling the process conditions such as the plating bath composition, current, temperature, time of plating, the plating may be adjusted according to need only thickness, and can change the appearance and properties of the coating. Use of fully automated mass production technology in the electronic components industry, an increasingly competitive market of today, people are electronic electroplating industry it serves also put forward higher requirements, such as coating thickness of each batch of product uniformity, hardness, brightness, the appearance will be consistent flatness, strictly control the plating zone, while reducin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 李初荣韦金宇陈钜夏海
Owner 珠海市板明科技有限公司