Wafer processing cleaning fluid, production method and equipment

Abstract

The invention relates to the technical field of cleaning fluid production, in particular to wafer processing cleaning fluid, a production method and equipment. The equipment comprises a preparation tank, a heating assembly and a cooling assembly, the heating assembly comprises a first electric heating net, a hollow heat conduction pipe, a heating pipe, an air guide plate, a hydraulic cylinder, a fan and a second electric heating net, the first electric heating net is electrified to generate heat, and the hollow heat conduction pipe transmits the heat to the side wall of the preparation tank to heat raw materials. Through arrangement of the first electric heating net and the hollow heat conduction pipe, the contact area with the preparation tank is increased, and thus the side wall of the preparation tank is uniformly heated. The hydraulic cylinder moves an air guide plate downwards, a heating pipe is inserted into a raw material, a fan and a second electric heating net are electrified, the heating pipe blows hot air into the raw material, the raw material in the middle of the preparation tank is heated uniformly, and the problems that traditional cleaning fluid production equipment conducts heating through a heating block, heating is not uniform, and the quality of the cleaning liquid is influenced by over-high local temperature are solved.

Description

technical field [0001] The invention relates to the technical field of cleaning liquid production, in particular to a wafer processing cleaning liquid, a production method and equipment. Background technique [0002] Wafers generally refer to silicon wafers. During the production process, the grease lubricated by mechanical equipment, metal ions in emery or working fluid, and the oxide layer formed after the silicon wafer contacts with air can cause varying degrees of pollution to the silicon wafer. Cleaning with cleaning fluid is required. [0003] The production of cleaning liquid is a complicated process. Traditional cleaning liquid production equipment is heated by a heating block. Some raw materials have too high temperature, and some raw materials have a constant temperature and are heated unevenly. Moreover, the local high temperature of raw materials will affect the quality of cleaning liquid. Contents of the invention [0004] The purpose of the present invention...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a wafer processing cleaning solution, production method and equipment, aiming to solve the problem that the traditional cleaning solution production equipment is heated by a heating block, the heating is uneven, and the local temperature is too high to affect the quality of the cleaning solution.

Images