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Bismaleimide compound, photosensitive resin composition using same, cured product from said photosensitive resin composition, and semiconductor element

A bismaleimide and compound technology, applied in the field of bismaleimide compounds, can solve the problems of insufficient patterning performance and wafer design limitations, and achieve small tensile elastic modulus and adhesion excellent effect

Active Publication Date: 2021-11-19
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the film thickness of a protective film for a semiconductor device is generally 5 μm or less, but there are often parts with a film thickness of 10 μm or more due to unevenness caused by wiring, and the patterning performance cannot be fully exhibited in such a part. Wafer Design Constraints Issues

Method used

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  • Bismaleimide compound, photosensitive resin composition using same, cured product from said photosensitive resin composition, and semiconductor element
  • Bismaleimide compound, photosensitive resin composition using same, cured product from said photosensitive resin composition, and semiconductor element
  • Bismaleimide compound, photosensitive resin composition using same, cured product from said photosensitive resin composition, and semiconductor element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0135] Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example. In addition, the patterning performance evaluation and mechanical property evaluation in each Example and a comparative example were performed as follows.

[0136] The measurement conditions of the molecular weight are as follows.

[0137] Model: GPC TOSOH HLC-8220GPC

[0138] Column: Super HZM-N

[0139] Eluent: THF (tetrahydrofuran); 0.35ml / min, 40°C

[0140] Detector: RI (Differential Refractometer)

[0141] Molecular weight standard: polystyrene

Synthetic example 1(I-1

[0143] 110 g of toluene and 36 g of N-methylpyrrolidone were charged into a 500 ml round bottom flask equipped with a stirring bar coated with the fluororesin. Next, 88.0 g (0.16 mol) of PRIAMINE 1074 (manufactured by Croda Japan Co., Ltd.) was added, and then, 15.8 g (0.16 mol) of methanesulfonic anhydride was slowly added to form a salt. Stir roughly for 10 minutes to mix, then slowly add 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride ( 21.8 g, 0.08 mol). Attach a Dean-Stark separator and condenser to the flask. The mixture was heated to reflux for 6 hours to form the amine terminated imide. The theoretical amount of water formed from this condensation is obtained by this time. The reaction mixture was cooled below room temperature, and 19.4 g (0.20 mol) of maleic anhydride was added to the flask. The mixture was refluxed for 8 hours to obtain the expected amount of water formed. After cooling to room temperature, 200 ml of toluene was ...

Synthetic example 2(I-2

[0145] 110 g of toluene and 36 g of N-methylpyrrolidone were charged into a 500 ml round bottom flask equipped with a stirring bar coated with the fluororesin. Next, 90.5 g (0.17 mol) of PRIAMINE 1074 (manufactured by Croda Japan Co., Ltd.) was added, and then, 16.3 g (0.17 mol) of methanesulfonic anhydride was slowly added to form a salt. Stir roughly for 10 minutes to mix, then slowly add 1,2,4,5-cyclohexanetetracarboxylic dianhydride (18.9 g, 0.08 mol) to the stirred mixture. Attach a Dean-Stark separator and condenser to the flask. The mixture was heated to reflux for 6 hours to form the amine terminated imide. The theoretical amount of water formed from this condensation is obtained by this time. The reaction mixture was cooled below room temperature, and 19.9 g (0.20 mol) of maleic anhydride was added to the flask. The mixture was refluxed for 8 hours to obtain the expected amount of water formed. After cooling to room temperature, 200 ml of toluene was then added to...

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Abstract

Provided is a bismaleimide compound (I) that has a cyclic imide bond and is obtained by the reaction of a diamine (A) derived from a dimer acid, a tetracarboxylic dianhydride (C) having an alicyclic structure, and maleic anhydride.

Description

technical field [0001] The present invention relates to a bismaleimide compound, a photosensitive resin composition using the bismaleimide compound, its cured product and a semiconductor device. The photosensitive resin composition of the present invention can be suitably used for a protective film for a semiconductor device, an interlayer insulating film, an insulating film for a rewiring layer, and the like. Background technique [0002] It is known that protective films for semiconductor devices, interlayer insulating films formed on semiconductor surfaces, and insulating films of rewiring layers use polyimide precursors or polybenzoxazoles that are excellent in heat resistance, electrical properties, and mechanical properties. Precursor photosensitive resin composition. As the above-mentioned photosensitive resin composition containing a polyimide precursor, for example, Japanese Patent Application Laid-Open No. 54-109828 (Patent Document 1) describes a compound contain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12G03F7/027G03F7/031
CPCG03F7/031G03F7/027C08G73/121C08G73/12C08G73/124H01L23/3171H01L23/293G03F7/004H01L23/5329
Inventor 山本和义内藤伸彦加贺大树锷本麻衣
Owner NIPPON KAYAKU CO LTD
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