Suspension, grinding fluid and preparation method thereof

A technology of suspension and grinding liquid, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as unevenness, scratches, and surface wear of grinding discs, so as to reduce accumulation and precipitation and increase usage effect, the effect of increasing the service life

Inactive Publication Date: 2021-11-26
威科赛乐微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing grinding liquid has poor uniformity and dispersibility, and the grinding powder in the grinding liquid is easy to pile up into agglomerates and settle at the bottom of the container, causing differences in the ratio of the wafer grinding liquid. During the grinding process, the grinding powder in the grinding liquid Abrasives will also gather, causing large particle aggregates in the polishing liquid to scratch the surface of the wafer, resulting in fine wear on the surface of the grinding disc, and the uneven surface of the grinding disc will also cause scratches on the surface of the wafer, affecting the surface of the wafer. Wafer Grinding Efficiency and Yield

Method used

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  • Suspension, grinding fluid and preparation method thereof
  • Suspension, grinding fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The suspension of this embodiment includes the following mass percent raw materials: 10% sodium dodecylbenzene sulfonate, 30% sodium tripolyphosphate, 10% sulfomethylated polyacrylamide, 10% n-methylolated acrylamide , 2% phytic acid, 38% water.

[0027] The grinding liquid includes the following raw materials in mass percentage: 30% grinding powder, 1.5% grinding oil, 5% suspension, 63.5% deionized water.

[0028] Suspension preparation

[0029] According to the ratio, according to the formula of the suspension, weigh sodium dodecylbenzenesulfonate, sodium tripolyphosphate, acrylamide-sodium acrylate polymer, sulfomethylated polyacrylamide, n-methylolated acrylamide , phytic acid, adding it into water, stirring and mixing evenly to obtain a suspension.

[0030] Grinding liquid preparation

[0031] According to the proportion, weigh the grinding powder, grinding oil, and suspension respectively, first add the grinding powder α-alumina to deionized water, continue sti...

Embodiment 2

[0033] The suspension of this embodiment includes the following mass percent raw materials: 20% sodium dodecylbenzenesulfonate, 30% sodium tripolyphosphate, 10% acrylamide-sodium acrylate polymer, 10% n-methylolated acrylamide , 2% tea polyphenols, 28% water.

[0034] The grinding liquid includes the following raw materials in mass percentage: 30% grinding powder, 1.5% grinding oil, 6% suspension, 62.5% deionized water.

[0035] The preparation of the grinding oil and the preparation method of the grinding liquid are the same as in Example 1.

Embodiment 3

[0037] The suspension of this embodiment includes the following mass percent raw materials: 10% sodium dodecylbenzenesulfonate, 40% sodium tripolyphosphate, 10% acrylamide-sodium acrylate polymer, 10% n-methylolated acrylamide , 2% phytic acid, 28% water.

[0038] The grinding liquid includes the following raw materials in mass percentage: 30% grinding powder, 1.5% grinding oil, 7% suspension, 61.5% deionized water.

[0039] The preparation of the grinding oil and the preparation method of the grinding liquid are the same as in Example 1.

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Abstract

The invention discloses a suspension, a grinding fluid and a preparation method thereof, and relates to the technical field of semiconductor materials. The suspension liquid is prepared from the following raw materials: sodium dodecyl benzene sulfonate, sodium tripolyphosphate, an acrylamide-sodium acrylate polymer, sulfomethylated polyacrylamide, n-hydroxymethylated acrylamide, phytic acid and water, and the grinding fluid is prepared from the following raw materials: grinding powder, grinding oil, the suspension liquid and deionized water. According to the invention, the grinding liquid using the suspension liquid has high uniformity, and the suspension liquid can effectively reduce accumulation and precipitation of grinding powder in the grinding liquid in a mixture, so that the wafer grinding quality is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a suspension, a grinding liquid and a preparation method thereof. Background technique [0002] Grinding is a very important process in the entire semiconductor material processing. The main function of grinding is to use the abrasive particles coated or pressed on the grinding tool to finish the machined surface (such as cutting) through the relative movement of the grinding tool and the workpiece under a certain pressure. [0003] Wafer grinding is one of the most important processes before wafer polishing, and it is also an important link to remove slight defects of the wafer, adjust the flatness of the wafer surface, and achieve a high-quality wafer surface. Only after the wafer is ground, the removable scratches, saw lines, dirty marks and other defects on the surface can be removed to achieve a suitable TTV and WARP, and a flat wafer surface can be obtained...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B1/00
CPCC09K3/1463B24B1/00
Inventor 周一毕洪伟彭杰
Owner 威科赛乐微电子股份有限公司
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