Method and device for nondestructive testing of crystal orientation difference and grain boundary defects in single crystal or oriented crystal

Abstract

The invention provides a method and device for nondestructive testing of crystal orientation difference and grain boundary defects in a single crystal or oriented crystal. The method comprises the following steps of: carrying out nondestructive testing of a crystal orientation angle (theta1, kappa1) of a crystal face in a certain direction (h1k1l1) in a sample by adopting transmission short-wavelength characteristic X-ray diffraction, and determining whether the orientation angle of the crystal face of the sample is out of tolerance or not; and in the (theta1, kappa1) direction of the crystal face, translating the sample, scanning and measuring the diffraction intensity and distribution of the (h1k1l1) crystal face of each part of the tested sample, and judging whether a grain boundary defect and a sub-grain boundary defect exist in the tested sample or not according to a measurement result. The device comprises a sample table, an X-ray irradiation system, an X-ray detection system, a rotating mechanism and the like, wherein the rotating mechanism is used for changing an included angle between an incident X-ray beam and a sample. With the method adopted, the problem that crystal defects such as crystal orientation difference, sub-grain boundary and grain boundary in the single crystal and the oriented crystal cannot be quickly, accurately and nondestructively measured is solved.

Description

Technical field [0001] The present invention relates to a non-destructive detection technique of crystalline defects, and more particularly to non-destructive detection of single crystals or methods and apparatus for unity and grain boundary defects of single crystals or directional crystals. Background technique [0002] The internal defects of single crystals and directional crystals are usually divided into two major categories, and one is a deficiencies such as air holes, inclusion, and the other is crystal alignment angles, crystal defects such as grain boundaries. For the former, it is usually used to non-destructive inspection materials / workpiece, which detects the X-ray absorption coefficient of different positions of the material / workpiece, and its distribution according to X-ray absorption coefficients. Differentially determines the pores, inclusions, etc. For the latter, a cut-cut single crystal is usually used, and the tie crystal is or corroded. It is detected wh...

AI Technical Summary

Problems solved by technology

Of course, the orientation angle is measured position by position on the surface. According to the difference in the orientation angle of each position on the surface of the single crystal or oriented crystal body measured, the difference in the orientation angle of adjacent positions is greater than 10°. °~10° is a small-angle grain boundary to identify and determine grain boundary defects, and the difference in orientation angle is less than 2° is a sub-grain grain boundary to identify and determine sub-grain boundary defects, but the orientation angle of single crystal and oriented crystal surface will be detected by surface position one by one It takes too long to be theoretically possible but practically impossible, and there is no existing literature on methods and techniques for non-destructive testing of orientation angles and internal grain boundary defects in single crystals and oriented crystals

Images