Low-temperature sintered glass ceramic powder as well as preparation method and application thereof

A technology of glass ceramics and low-temperature sintering, which is applied in the field of functional ceramics. It can solve the problems of high high-frequency loss and large variation of dielectric constant with frequency, and achieve the effects of reducing content, reducing dielectric constant and thermal expansion coefficient, and solving poor matching.

Active Publication Date: 2021-12-07
SHENZHEN TAOTAO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a low-temperature sintered glass-ceramic powder and its preparation method and application, so as to solve the problems of high frequency loss of low-temperature sintered dielectric materials and large changes in dielectric constant with frequency

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  • Low-temperature sintered glass ceramic powder as well as preparation method and application thereof
  • Low-temperature sintered glass ceramic powder as well as preparation method and application thereof
  • Low-temperature sintered glass ceramic powder as well as preparation method and application thereof

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Embodiment 1

[0036]Embodiment 1: the preparation method of the low-temperature sintered glass-ceramic powder of the present embodiment, the specific steps are as follows:

[0037] S1. Preparation of the first powder: weigh 10 parts by mass of B 2 o 3 , 45 parts by mass of CaO and 45 parts by mass of SiO 2 , after fully mixing, place in a corundum crucible or a platinum crucible for melting, the melting temperature is 1400°C, and the melting time is 30 minutes to obtain a melt, which is poured into water for quenching. After drying the quenched melt, the particle size after ball milling was 5 μm. Then it was placed in a muffle furnace for heat treatment, the heating temperature of the heat treatment was 850° C., and the heating time of the heat treatment was 1 h to obtain the first powder.

[0038] S2. Preparation of the second powder: Weigh 20 parts by mass of H 3 BO 3 , 40 parts by mass of CaO and 40 parts by mass of C 8 h 20 Si, after being fully mixed, was dissolved in water at a...

Embodiment 2

[0041] Embodiment 2: The preparation method of the low-temperature sintered glass-ceramic powder of this embodiment is basically the same as the steps of Embodiment 1, and will not be repeated here. The difference is:

[0042] S1. Preparation of the first powder: weigh 5 parts by mass of B 2 o 3 , 47.5 parts by mass of CaO and 47.5 parts by mass of SiO 2 . After fully mixing, place it in a corundum crucible or a platinum crucible for melting. The melting temperature range is 1500°C, and the particle size after ball milling is 3-4 μm. The heating temperature of the heat treatment was 800°C.

[0043] S2. Prepare the second powder: weigh 25 parts by mass of H 3 BO 3 , 37.5 parts by mass of CaO and 37.5 parts by mass of C 8 h 20 Si, after being thoroughly mixed, was dissolved in water at a concentration of 10 wt%.

[0044] S3. Mixing: mixing the first powder and the second powder in a mass ratio of 8:1.

[0045] In order to facilitate subsequent verification of the perfor...

Embodiment 3

[0046] Embodiment 3: The preparation method of the low-temperature sintered glass-ceramic powder of this embodiment is basically the same as the steps of Embodiment 1, and will not be repeated here. The difference is:

[0047] S1. Preparation of the first powder: weigh 10 parts by mass of B 2 o 3 , 50 parts by mass of CaO and 40 parts by mass of SiO 2 . The particle size after ball milling is 5-8 μm. The heating temperature of the heat treatment is 780°C, and the heating time of the heat treatment is 1.5h.

[0048] S2. Preparation of the second powder: Weigh 20 parts by mass of H 3 BO 3 , 50 parts by mass of CaO and 30 parts by mass of C 8 h 20 Si, after thorough mixing, was dissolved in water at a concentration of 6 wt%. The particle size of the second powder is 50nm.

[0049] S3. Mixing: mixing the first powder and the second powder in a mass ratio of 4:1.

[0050] In order to facilitate subsequent verification of the performance of the low-temperature sintered gla...

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Abstract

The invention provides low-temperature sintered glass ceramic powder, which is prepared by compounding the following components in parts by mass: 3 to 10 parts of first powder and 1 part of second powder. The first powder is prepared from the following raw materials in parts by mass: 1 to 50 parts of B2O3, 35 to 65 parts of CaO and 10 to 65 parts of SiO2. The second powder is prepared from the following raw materials in parts by mass: 1 to 50 parts of H3BO3, 35 to 65 parts of CaO and 10 to 65 parts of C8H20Si. The invention also provides a preparation method of the low-temperature sintered glass ceramic powder. The preparation method comprises the following steps: mixing the raw materials of the first powder, smelting, quenching, drying, grinding and carrying out heat treatment; and allowing raw materials of the second powder to be dissolved and subjected to spray granulation. The invention also provides application of the low-temperature sintered glass ceramic powder in a low-temperature co-fired ceramic substrate. According to the low-temperature sintered glass ceramic powder as well as the preparation method and the application thereof, the high-frequency loss, the dielectric constant and the thermal expansion coefficient of a dielectric material are effectively reduced, so that the dielectric material has better comprehensive performance.

Description

technical field [0001] The invention belongs to the technical field of functional ceramics, in particular to a low-temperature sintered glass ceramic powder and its preparation method and application. Background technique [0002] With the rapid development of electronic communication technology, the number of electronic components per unit volume has increased sharply, and the industry's demand for high-frequency, low-dielectric constant low-temperature co-fired ceramic substrates is increasing day by day, which requires the dielectric materials for preparing ceramic substrates. Low electrical constant, low high-frequency loss, thermal expansion coefficient similar to that of the chip, and high thermal conductivity. [0003] At present, low-temperature co-fired ceramic substrates often have problems such as high high-frequency loss, large variation of dielectric constant with frequency, warping when co-fired with metal paste, and low thermal conductivity. The high frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/01C04B35/626C03C12/00C03C6/04
CPCC04B35/01C04B35/62605C04B35/62695C03C12/00C03C1/00C04B2235/3409C04B2235/3208C04B2235/483C04B2235/365C04B2235/96C04B2235/9607
Inventor 李程峰余明先向明王伟江戴高环刘建国
Owner SHENZHEN TAOTAO TECH CO LTD
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