High-filling ultrahigh-heat-conducting epoxy resin material and preparation method thereof

An epoxy resin, ultra-high technology, applied in the field of high-filled ultra-high thermal conductivity epoxy resin materials and preparation, can solve the problem that thermal conductivity cannot meet the needs of use, and achieve good thermal conductivity, ensure the process, and ensure stability.

Active Publication Date: 2021-12-10
苏州森孚感知科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the invention focuses on improving the mechanical properties of the material rather than the thermal conductivity in the case of high filling, and the thermal conductivity of the prepared material cannot meet the use requirements when used in electrical equipment

Method used

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  • High-filling ultrahigh-heat-conducting epoxy resin material and preparation method thereof
  • High-filling ultrahigh-heat-conducting epoxy resin material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0050] The preparation method of highly filled ultrahigh thermal conductivity epoxy resin material comprises the following steps:

[0051] First, 15-25% of boron nitride with a particle size of 30-70nm, 50-65% of the large particle size aluminum oxide with a particle size of 80-120μm, and 6-14% of the small particle size type with a particle size of 40-60nm Aluminum oxide, 10-20% aluminum nitride with a particle size of 10-30nm, and 4-8% zinc oxide heat-conducting powder with a particle size of 80-120nm are mixed according to the proportion and then poured into a tray and placed in an oven. Dehumidify at 145°C for 120-200min, then cool naturally in an oven. The humidity in the oven room is below 30%, and the composite heat-conducting powder is obtained after drying.

[0052] Secondly, pour the composite heat-conducting powder into the milling, dispersing and modifying all-in-one machine, add titanium / aluminate coupling agent, aliphatic epoxy resin, and also add silane couplin...

Embodiment 1

[0056] A high-filling super-high thermal conductivity epoxy resin material, which is prepared from component A and component B; component A is a mixture of epoxy resin base material and modified thermal conductive powder; component B is composed of curing agent, accelerator A mixture of mixing aids and modified thermally conductive powders consisting of a curing agent and a toughening agent; the mass percentage ratio of the curing agent, the accelerator and the toughening agent is 2:1.5:1.

[0057] Wherein, the epoxy resin base material is tetrabromobisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl hexahydroanhydride; the accelerator is an imidazole polymer; the toughening agent is an active toughening agent; The active toughening agent is prepolymer polyurethane.

[0058] The mass percentage ratio of A component to the B component is 1:1; the mass percentage ratio of epoxy resin base material and modified thermal conductive powder in...

Embodiment 2

[0067] A high-filling super-high thermal conductivity epoxy resin material, which is prepared from component A and component B; component A is a mixture of epoxy resin base material and modified thermal conductive powder; component B is composed of curing agent, accelerator A mixture of mixing aids and modified thermally conductive powders consisting of a curing agent and a toughening agent; the mass percentage ratio of the curing agent, the accelerator and the toughening agent is 2.5:1.5:1.

[0068] Among them, the epoxy resin is hydrogenated bisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl tetrahydroanhydride; the accelerator is a complex cation; the toughening agent is an active toughening agent; The agent is polythiol and prepolymer polyurethane.

[0069]The mass percentage ratio of A component to the B component is 1.2:1; the mass percentage ratio of epoxy resin base material and modified thermal conductive powder in A component...

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Abstract

The invention belongs to the technical field of heat-conducting materials under an ultrahigh heat-conducting filling technical system, and particularly relates to a high-filling ultrahigh-heat-conducting epoxy resin material and a preparation method thereof. The material is prepared from a component A and a component B, wherein the component A is a mixture of an epoxy resin base material and modified heat-conducting powder; the component B is a mixture of a mixed additive and modified heat-conducting powder; the mass percentage ratio of the epoxy resin base material to the modified heat-conducting powder in the component A is 100: (65-95); the mass percentage ratio of the mixed additive to the modified heat-conducting powder in the component B is 100: (65-95); the mass percentage ratio of the component A to the component B is (0.8-1.2): 1; and the modified heat-conducting powder is composite heat-conducting powder modified by a modifier. By modifying the composite heat-conducting powder with different particle sizes, the compatibility of the powder and an epoxy resin base material is effectively improved, so that the heat conductivity is greater than or equal to 2.5 W.m <-1 >. K <-1 >, the volume resistivity is greater than or equal to 2.2 * 10 < 15 > omega.cm, and the breakdown strength is greater than or equal to 24V/mm.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting insulating materials, and in particular relates to a high-filling ultra-high heat-conducting epoxy resin material and a preparation method thereof. Background technique [0002] With the dry-type transformers, dry-type core reactors under the glass mesh cloth process, dry-type transformers, pot insulators, dry-type bushings and other electrical equipment under the vacuum drawing process and vacuum extrusion process, the insulation materials The requirements for thermal conductivity are getting higher and higher, how to improve the thermal conductivity of materials has become the focus of current research. Adding high thermal conductivity powder fillers to epoxy resin is a commonly used method to improve the thermal conductivity of materials. Although metal powder is often used to try to improve the thermal conductivity of epoxy resin, the insulation of metal powder to epoxy resin Performa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L75/08C08K9/10C08K3/38C08K3/22C08K3/28
CPCC08L63/00C08K2003/2227C08K2201/014C08K2201/005C08K2003/2296C08K2003/385C08K2003/282C08L75/08C08K9/10C08K3/38C08K3/22C08K3/28
Inventor 舒孚
Owner 苏州森孚感知科技有限公司
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