Built-in circulating passive cooling module and method for air-cooled small-power solid laser of all-in-one machine

Abstract

The invention relates to a built-in circulating passive cooling module and method for an air-cooled small-power solid laser of an all-in-one machine. The module comprises a module seat, the top of the module seat is provided with a cooling bottom plate for installing the laser, and the cooling bottom plate is internally provided with an S-shaped water channel. A water pump communicated with the hot water outlet of the S-shaped water channel and a water cooling disc communicated with the water pump are arranged in the module base, the outlet of the water cooling disc is communicated with the cold water inlet of the S-shaped water channel, an air outlet is formed in the side wall of one side of the module seat, and a water cooling disc fan set is arranged at the position, close to the air outlet, in the module seat. The water cooling disc is arranged between a water cooling disc fan group and the air outlet, and a power supply interface for controlling the water cooling disc fan group to work is arranged on the module seat. Large-air-volume fans and the water cooling disc are utilized, and the built-in circulating water device is additionally arranged, so that the cooling bottom plate provided with the laser can effectively and uniformly dissipate heat, and the low-power solid laser arranged on the cooling bottom plate can reach a dynamic stable state.

Description

technical field [0001] The invention belongs to the technical field of laser beam processing, such as welding, cutting and drilling, and is particularly a compact passive cooling module suitable for an integrated machine of low-power air-cooled solid-state lasers. Background technique [0002] The cooling methods of laser crystals in all-solid-state lasers can be roughly divided into three methods: "liquid cooling, semiconductor cooling, and air-cooling conduction heat dissipation". [0003] Among them, liquid cooling can achieve a better cooling effect by controlling the temperature and flow of the liquid. It uses constant temperature water as the cooling method and requires a separate laser water cooler to provide cooling; the added laser water cooler has no advantages in terms of cost. It will not be able to meet the requirements in an environment with high humidity requirements. [0004] Semiconductor (TEC) cooling needs to add heat sink fan cooling on the basis of semi...

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Problems solved by technology

[0005] The cooling temperature of water cooling and semiconductor refrigeration is generally lower than room temperature. In actual use, the local temperature of the crystal surface is often lower than room temperature. It is easy to fog when encountering cold air in the air, and it is easy to damage the crystal surface when the laser is running, reducing the use of the laser. In addition, in the end-pumped laser, due to the limitations of various cooling methods, it can only rely on side cooling. There is a high temperature difference between the middle and the edge of the laser crystal along the vertical section of the laser operation, and the resulting heat Lens effect degrades laser beam output light pattern

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