Resist underlayer film forming composition containing alicyclic compound-terminated polymer
A technology of resist lower layer and composition, which is applied in the photoplate-making process of patterned surface, photosensitive materials used in optomechanical equipment, instruments, etc., can solve the problems of active light diffuse reflection standing wave, etc., and achieve sensitivity improvement, Effect of LWR Deterioration Suppression
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[0151] The above synthesis examples 1 to 9, comparative synthesis examples 1 to 2, polymer, crosslinking agent, curing catalyst, and solvent were mixed in the ratio shown in Table 1, and filtered with a 0.1 μm filter made of fluororesin, thereby respectively A solution of the composition for forming a resist underlayer film was prepared.
[0152] In Table 1, tetramethoxymethyl glycoluril (manufactured by Japan Cytech Indastries Co., Ltd.) is abbreviated as PL-LI, and pyridine - P-toluenesulfonic acid is abbreviated as PyPTS, and pyridine - P-hydroxybenzenesulfonic acid is abbreviated as PyPSA, propylene glycol monomethyl ether acetate is abbreviated as PGMEA, and propylene glycol monomethyl ether is abbreviated as PGME. Each addition amount is represented by mass parts.
[0153] [Table 1]
[0154] Table 1
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[0156] [Table 2]
[0157] Table 2
[0158]
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