Equipment for continuously preparing high-silicon aluminum alloy through graded pressure impregnation

Abstract

The invention discloses equipment for continuously preparing a high-silicon aluminum alloy through graded pressure impregnation. The equipment comprises a feeding device, a cooling furnace tube and at least two sections of heating furnace tubes, wherein the heating furnace tubes are connected in sequence; the feeding device is in butt joint with the first section of heating furnace tube; the cooling furnace tube is connected with the last section of heating furnace tube; a material conveying screw is arranged in each section of heating furnace tube; the material conveying screw is correspondingly provided with a rotation driving device; the screw pitch of the material conveying screw in the last section of heating furnace tube is gradually reduced in the material conveying direction; and the temperature in the last section of heating furnace tube is set to be the temperature above a metal aluminum liquidus. According to the equipment, the mixed materials are sequentially subjected to multi-stage pressurizing, heating and stirring in the furnace tube, then the material conveying screw is overlaid for pressurizing, so that crystal grains of the mixed materials can be rearranged, finally, the silicon-aluminum composite material with good uniformity, high density and excellent machining performance is formed, the problem of material layering of a high-silicon aluminum alloy prepared through traditional pressure impregnation is solved, and continuous preparation is realized.

Description

technical field [0001] The invention relates to equipment for preparing high-silicon aluminum alloys, in particular to equipment for continuously preparing high-silicon aluminum alloys by graded pressure impregnation. Background technique [0002] With the rapid development of modern electronic information technology and large-scale integrated circuit devices, the integration and power of electronic devices are getting higher and higher, and the heat dissipation of devices has become the key to hinder the rapid development of integrated circuits. High-quality electronic packaging materials, traditional electronic packaging materials can no longer meet the needs of the development of modern electronic technology. High-silicon aluminum alloy (Si-wt.% ≥ 90%) has the advantages of low thermal expansion coefficient, high thermal conductivity, and low density because of its adjustable ratio of Al matrix to reinforcing phase Si, and can be compared with GaAs or Si and other chip ma...

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Problems solved by technology

[0008] (1) The alloy prepared by smelting and casting method has poor mechanical properties and low yield, which is not suitable for large-scale production

[0009] (2) The thermal expansion coefficient of the alloy prepared by the powder metallurgy method is relatively high, which cannot meet the production requirements of silicon-aluminum alloys with higher silicon content (Si-wt.% ≥ 90%)

[0010] (3) The preparation process of the spray deposition method is complicated, the preparation process is difficul

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