Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of epoxy compound adhesive and cover film and preparation method

A compound and adhesive technology, applied in adhesives, epoxy resin glue, polyether adhesive, etc., can solve the problem of poor Tg performance of bonding materials, achieve high peel strength, meet performance requirements, and high Tg effect

Active Publication Date: 2022-05-06
GUANGZHOU LIANMAO ELECTRONICS TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an epoxy composite adhesive, a covering film and a preparation method to solve the technical problem of poor Tg performance of the current bonding material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of epoxy compound adhesive and cover film and preparation method
  • A kind of epoxy compound adhesive and cover film and preparation method
  • A kind of epoxy compound adhesive and cover film and preparation method

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0051] An epoxy composite adhesive, comprising the following raw material components: acrylate rubber 4wt%, polyvinyl butyral 8wt%, bisphenol A epoxy resin 10wt%, phenoxy resin 3wt%, diaminodiphenyl sulfone 2.4 wt%, 2-ethyl-4-methylimidazole 0.05wt%, OP935 flame retardant 6wt%, aluminum hydroxide 6wt%, methyl ethyl ketone 60.55wt%; Wherein, phenolic resin is specifically DOW92566 resin, each component Adhesives are prepared after mixing.

preparation example 2

[0053]An epoxy composite adhesive, comprising the following raw material components: acrylate rubber 5wt%, polyvinyl butyral 10wt%, bisphenol A epoxy resin 15wt%, phenoxy resin 5wt%, diaminodiphenyl sulfone 0.5 wt%, 1-cyanoethyl-2-methylimidazole 2wt%, FP-110 flame retardant 5wt%, titanium dioxide 5wt%, toluene 52.5wt%; Among them, the phenolic resin is specifically DIC4816 resin, and the components are mixed Then make the adhesive.

preparation example 3

[0055] An epoxy composite adhesive, comprising the following raw material components: 10wt% of acrylate rubber, 15wt% of polyvinyl butyral, 5wt% of bisphenol A epoxy resin, 10wt% of phenoxy resin, and 5wt% of diaminodiphenylmethane %, 1wt% of 2-methylimidazole, 15wt% of SPB-100 flame retardant, 10wt% of talc, 29wt% of propylene glycol methyl ether; wherein, the phenolic resin is specifically JER1256 resin, and the adhesive is obtained after mixing the components.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an epoxy composite adhesive, a covering film and a preparation method, and relates to the field of adhesives. Adhesives mainly include acrylic elastomer: 2wt%-10wt%; polyvinyl butyral: 8wt%-15wt%; bisphenol A epoxy resin: 5wt%-15wt%; phenolic resin: 3wt%-10wt% ;Aromatic amine curing agent: 0.5wt%-5wt%; imidazole accelerator: 0.05wt%-2wt%; nitrogen-phosphorus flame retardant: 5wt%-15wt%, etc. This application controls the content of the key components polyvinyl butyral, acrylic elastomer, nitrogen-phosphorus flame retardant and aromatic amine curing agent through the synergistic effect of each component in the formula, so that the final synthesis has Epoxy compound adhesive with high Tg and high peel strength can be applied to electronic products in high temperature operating environment to meet performance requirements.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an epoxy composite adhesive, a covering film and a preparation method. Background technique [0002] Nowadays, with the rapid development of science and technology, while improving the function and performance of electronic equipment, it is also rapidly developing towards miniaturization and light weight. As the basic material of the FPC industry of the circuit board, the copper clad laminate and the cover film are produced in response to the demand. Also getting bigger and bigger. [0003] Due to the improvement of information transmission speed and the increase of calorific value, the operating temperature of the circuit board is also getting higher and higher. The cover film commonly used now is made of adhesive material toughened by nitrile rubber to ensure softness. , so that the Tg temperature of the cover film is not high, it is difficult for the material to maintain the bending ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J129/14C09J133/00C09J171/12C09J11/04C09J7/25C09J7/30C09J7/40
CPCC09J163/00C09J129/14C09J11/04C09J7/25C09J7/30C09J7/40C08K2003/2227C08K2003/2241C09J2301/122C09J2479/086C09J2301/408C09J2203/326C08L33/00C08L29/14C08L71/12C08K3/22C08L63/00C08K3/34
Inventor 牛新星周祺昌
Owner GUANGZHOU LIANMAO ELECTRONICS TECH