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Conductive paste for electronic component

A technology of electronic components and conductive paste, which is applied in the field of conductive paste, can solve the problems of reduced conductivity, high price, short circuit of electrodes, etc., and achieve the effect of reducing sintering temperature, reducing production cost and improving work efficiency

Pending Publication Date: 2022-01-04
XUANTAI ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the conductive paste uses conductive metal particles such as gold, silver, palladium, copper, and aluminum. Due to the high price of gold and palladium, silver is usually used as the conductive particle powder in the field of high conductivity, but silver The price of the conductive paste is also higher, second only to gold and palladium, which increases the cost of the conductive paste and is difficult to be widely used
Moreover, when a voltage is applied, migration is prone to occur, and in long-term use, there will be a problem of short circuit between electrodes or lines
[0004] Copper metal not only has good electrical conductivity, but also has low cost, so it is widely used in electronic products, but the problem is that copper is chemically active and easy to oxidize
Therefore, the existing copper solder pastes all have the problem that the sintering temperature is too high, and copper oxide will be formed on the surface of the copper particles, resulting in a decrease in electrical conductivity.

Method used

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  • Conductive paste for electronic component
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Examples

Experimental program
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Effect test

specific Embodiment 1

[0035] A conductive paste for electronic components, including components and the content of each component: by weight, 66 parts of conductive metal powder, 5 parts of glass, 1 part of dispersant, 2 parts of coupling agent, and 22.5 parts of solvent , 3.5 parts of ethyl cellulose. Among them, the conductive metal powder includes bronze and silver powder (0.2um), and the weight ratio of bronze and silver powder is 2:1. Using copper as the main metal can avoid the effect of atomic migration when silver metal is used as an electrode.

[0036]

[0037] It can be seen from the above that in this embodiment, when the manufacturing temperature is 600° C., the performance of the capacitor and the metal electrode is the best.

specific Embodiment 2

[0039] A conductive paste for electronic components, including components and the content of each component: in parts by weight, 66 parts of conductive metal powder, 6 parts of glass, 1 part of dispersant, 2 parts of coupling agent, and 21 parts of solvent , 4 parts of ethyl cellulose. Among them, the conductive metal powder includes bronze powder, silver-coated copper powder and tin powder, and the weight ratio of bronze powder, silver-coated copper powder and silver powder (< 0.2um) is 4:4:2. Copper powder and silver-coated copper powder are used as the main metal. In order to avoid oxidation, the surface of silver-coated copper powder is covered with silver metal as protection, so that it will not be oxidized during air sintering.

[0040]

[0041] It can be seen from the above that in this embodiment, when the manufacturing temperature is 500-550° C., the performance of the capacitor and the metal electrode is the best.

specific Embodiment 3

[0043] A conductive paste for electronic components, including components and the content of each component: in parts by weight, 64.2 parts of conductive metal powder, 5 parts of glass, 1 part of dispersant, 2 parts of coupling agent, and 24 parts of solvent , 3.8 parts of ethyl cellulose. Among them, the conductive metal powder includes cupronickel and silver powder (0.2um), and the weight ratio of cupronickel and silver powder is 5:1.

[0044]

[0045] It can be seen from the above that in this embodiment, when the manufacturing temperature is 650° C., the performance of the capacitor and the metal electrode is the best.

[0046] The beneficial effects of the conductive paste for electronic components of the present invention are:

[0047] 1. The sintering temperature of the conductive paste is reduced, saving energy and reducing production costs.

[0048] 2. When sintering in air, replacing part of the silver metal with copper can effectively reduce the material cost. ...

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Abstract

The invention discloses a conductive paste for an electronic component such as a single-layer or multi-layer capacitor, a varistor, a surge absorbing element and the like. The conductive paste comprises conductive metal powder, glass, resin, a solvent and a chemical additive. Through the mode, when the conductive paste for the electronic component is sintered in the air, copper is used for replacing part of silver metal, so that the problem of copper oxidation is solved, the sintering temperature can be reduced, energy is saved, the production cost and the manufacturing difficulty are reduced, the manufacturing time is shortened, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the field of conductive paste, in particular to a conductive paste used for electronic components, such as single-layer or multi-layer capacitors, piezoresistors, surge absorbing components and the like. Background technique [0002] Conductive paste, also known as electric composite grease, is a new type of electrical material that can be used on the contact surface of electric connectors. [0003] At present, the conductive paste uses conductive metal particles such as gold, silver, palladium, copper, aluminum, etc. Due to the high price of gold and palladium, silver is usually used as the conductive particle powder in the field of high conductivity, but silver The price of the conductive paste is also higher, second only to gold and palladium, which increases the cost of the conductive paste and is difficult to be widely used. Moreover, when a voltage is applied, the phenomenon of migration is easy to occur, and there will ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02
CPCH01B1/026H01B1/02
Inventor 杨竣越杨荣隆
Owner XUANTAI ELECTRONICS SUZHOU
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