Positive photoresist composition

Abstract

The invention provides a positive photoresist composition which is prepared from the following components based on the total weight of the positive photoresist composition: 10-20 wt% of phenolic resin, 4-6 wt% of a photosensitive compound, 5-10 wt% of a cross-linking agent, 0.05-0.10 wt% of a flatting agent, 0.05-0.10 wt% of an adhesion promoter and 65-80 wt% of a solvent, wherein the phenolic resin is linear phenolic resin, the structural formula of the phenolic resin is shown as a formula I in the description, n1 is a natural number, and n1 is greater than or equal to 85 and less than or equal to 170. The positive photoresist composition provided by the invention has the characteristic of high heat resistance, the heat-resistant temperature can reach 230-250 DEG C, the positive photoresist composition can be used for a production process with a high-temperature process, and a good pattern morphology can be formed in an exposure process. Meanwhile, the positive photoresist composition has good uniformity, and when the positive photoresist composition is used for a peripheral circuit, the occurrence of disintegration during edge grinding can be effectively reduced.

Description

technical field [0001] The present application relates to the field of photoresist technology, in particular to a positive photoresist composition. Background technique [0002] Thin film transistor liquid crystal display (TFT-LCD) is a large-scale semiconductor full integrated circuit manufacturing technology using new materials and new processes, and is the basis of liquid crystal, inorganic and organic thin film electroluminescent flat panel displays. As the size of the panel increases, in the production process, cutting and edging are inevitable. However, due to the problem of edge embrittlement, the edge of the substrate will collapse during edging, which will lead to the lack of peripheral circuit areas (that is, the peripheral circuit Defective phenomenon of collapse during edging), forming circuit defects. The photoresist composition currently used in the market is generally not high in heat resistance, and the pattern (patten) morphology will change at high tempera...

AI Technical Summary

Problems solved by technology

As the size of the panel increases, in the production process, cutting and edging are inevitable. However, due to the problem of edge embrittlement, the edge of the substrate will collapse during edging, which will lead to the lack of peripheral circuit areas (that is, the peripheral circuit Collapsing defects during edging), forming circuit defects

The photoresist composition currently used in the market is generally not high in heat resistance, and the pattern (patten) morphology will change at high temperature, and when used in peripheral circuits, it may sometimes collapse during the edging process.

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