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A nickel-based solder ring and its preparation method

A nickel-based brazing filler metal, mass fraction technology, applied in welding equipment, manufacturing tools, metal processing equipment and other directions, can solve the problems of high brittleness, easy cracking and falling off, hard ring of nickel-based brazing filler metals, etc., and achieves high fineness. , Excellent elasticity, the effect of improving the bonding strength

Active Publication Date: 2022-04-19
CHINA INNOVATION ACADEMY OF INTELLIGENT EQUIP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventionally pressed nickel-based solder rings are hard and brittle, and are easy to break and fall off during transportation or use

Method used

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  • A nickel-based solder ring and its preparation method
  • A nickel-based solder ring and its preparation method
  • A nickel-based solder ring and its preparation method

Examples

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preparation example Construction

[0043] see figure 2 , further, the preparation method provided by the invention comprises the following steps:

[0044] S10: Obtain toughening fiber 1, nickel-based solder and lead-free glass powder 2 in parts by mass;

[0045] S20: Dissolving the toughening fiber 1 in acetone, ultrasonically dispersing for 10-15 minutes; adding epoxy resin, nickel-based solder and lead-free glass powder 2, and stirring evenly to obtain a slurry;

[0046] S30: Obtain the steel rod 3, coat the surface of the steel rod with dimethyl silicone oil, uniformly press-coat the slurry on the surface of the steel rod, dry, sinter, strip, and cut to obtain the nickel-based solder ring 4.

[0047] Wherein, the drying temperature is 100-120° C., and the drying time is 1-1.5 hours; the sintering temperature is 650-700° C., and the sintering time is 1.5-2 hours.

[0048] In the embodiment of the present invention, the dough-like slurry is press-coated on the surface of the steel bar, and then dried, sinte...

Embodiment 1

[0050] This embodiment provides a nickel-based solder ring, which includes the following components in parts by mass: 0.5 parts by mass of toughening fiber; 10 parts by mass of lead-free glass powder; and 89.5 parts by mass of nickel-based solder.

[0051] Wherein, the toughening fiber is carbon fiber, and the length of the toughening fiber is 2mm-3mm.

[0052] Lead-free glass powder is B 2 o 3 -SnO-ZnO, the particle size of the glass powder is 300-500 mesh.

[0053] The nickel-based solder is BNi-1, and the particle size of the nickel-based solder is 200 mesh to 300 mesh.

[0054] This embodiment also provides a method for preparing the above-mentioned nickel-based solder ring, comprising the following steps:

[0055] S10: Obtain toughening fiber, lead-free glass powder and nickel-based solder according to parts by mass;

[0056] S20: Dissolving the toughening fiber in acetone, and ultrasonically dispersing it for 10 minutes; adding epoxy resin, lead-free glass powder and...

Embodiment 2

[0060] This embodiment provides a nickel-based solder ring, which includes the following components in parts by mass: 2 parts by mass of toughening fiber; 16 parts by mass of lead-free glass powder; and 82 parts by mass of nickel-based solder.

[0061] Wherein, the toughening fiber is polyester fiber, and the length of the toughening fiber is 2mm-3mm.

[0062] Lead-free glass powder is B 2 o 3 -SnO-ZnO and B 2 o 3 -BaO-ZnO, the particle size of the glass powder is 300-500 mesh.

[0063] The nickel-based solder is BNi-1 and BNi-2, and the particle size of the nickel-based solder is 200 mesh to 300 mesh.

[0064] This embodiment also provides a method for preparing the above-mentioned nickel-based solder ring, comprising the following steps:

[0065] S10: Obtain toughening fiber, lead-free glass powder and nickel-based solder according to parts by mass;

[0066] S20: Dissolving the toughening fiber in acetone, ultrasonically dispersing for 12 minutes; adding epoxy resin, l...

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Abstract

The invention provides a nickel-based solder ring and a preparation method thereof, wherein the nickel-based solder ring comprises the following components in parts by mass: 0.5 parts by mass-2 parts by mass of toughening fibers; 10 parts by mass-20 parts by mass of lead-free glass powder Parts by mass; 78 to 89.5 parts by mass of nickel-based solder. The nickel-based solder ring provided by the invention has high bonding strength and is not easily broken during assembly and transportation.

Description

technical field [0001] The invention relates to the technical field of brazing, in particular to a nickel-based solder ring and a preparation method thereof. Background technique [0002] Stainless steel has good high temperature performance and corrosion resistance, and is widely used in the manufacture of stainless steel heat exchanger piping. Brazing is a key link in the manufacture of stainless steel heat exchanger piping, which determines the service life of the heat exchanger. Due to the higher requirements for high temperature performance, nickel-based brazing filler metals are generally used to braze stainless steel pipelines. [0003] For automatic welding, nickel-based filler metals pressed into rings are the best choice for brazing stainless steel piping. However, conventionally pressed nickel-based solder rings are hard and brittle, and are easy to break and fall off during transportation or use. Contents of the invention [0004] In view of the above proble...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/36B23K35/40
CPCB23K35/3033B23K35/3053B23K35/3606B23K35/365B23K35/0227B23K35/404
Inventor 纠永涛黄俊兰王琴周许升李文彬张冠星聂孟杰郭艳红薛行雁
Owner CHINA INNOVATION ACADEMY OF INTELLIGENT EQUIP CO LTD
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