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Self-adaptive parallel sealing and welding mechanism for microelectronic packaging in high vacuum state

A technology of microelectronic packaging and parallel sealing and welding, which is applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., to achieve self-adaptation, overcome short life, and save investment costs

Pending Publication Date: 2022-02-22
西北电子装备技术研究所
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Problems solved by technology

[0003] The invention provides a self-adaptive parallel sealing and welding mechanism for microelectronic packaging in a high vacuum state, which solves how to complete the high-quality parallel sealing and welding of the cover plate and the tube shell of a thin-shell device at low cost in a vacuum environment, thereby improving the sealing and welding Yield technical issues

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  • Self-adaptive parallel sealing and welding mechanism for microelectronic packaging in high vacuum state
  • Self-adaptive parallel sealing and welding mechanism for microelectronic packaging in high vacuum state
  • Self-adaptive parallel sealing and welding mechanism for microelectronic packaging in high vacuum state

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Embodiment Construction

[0019] The present invention is described in detail below in conjunction with accompanying drawing:

[0020] A self-adaptive parallel sealing and welding mechanism for microelectronic packaging in a high vacuum state, comprising a high vacuum airtight chamber, in which a box-shaped frame body 315 is arranged, and in front of the front side vertical plate 316 of the box-shaped frame body 315 On the facade, an eccentric wheel 323 is provided, and an airtight casing 328 of an eccentric wheel driving motor is arranged in the box-shaped frame body 315, and an eccentric wheel driving motor is arranged in the airtight casing 328, and a Air, the output shaft of the eccentric wheel drive motor, after passing through the sealed magnetic fluid, is connected together with the eccentric wheel shaft 322 of the eccentric wheel 323; a U-shaped frame plate 313 is buckled on the front facade of the front side vertical plate 316, and the eccentric wheel 323 is movably arranged in the framework o...

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Abstract

The invention discloses a self-adaptive parallel sealing and welding mechanism for microelectronic packaging in a high vacuum state, and solves the problem of how to complete high-quality parallel sealing and welding of a cover plate and a tube shell of a thin-shell device in a vacuum environment at low cost so as to improve the sealing and welding yield. The self-adaptive parallel sealing and welding mechanism is characterized in that a floating parallel welding wheel support is arranged, two parallel welding wheels on the support are pressed on parallel welding seams between a cover plate and a tube shell in a floating mode, weights are arranged at the top end of the parallel welding wheel support, and the welding pressure of the parallel welding wheels on the welding seams is adjusted by increasing or reducing the number of the weights, so that the adjustment of the self-adaptive welding pressure in the welding process is realized; and a shoulder-pole-shaped semi-square-shaped jacking frame body is arranged between the left parallel welding wheel support and the right parallel welding wheel support, the floating parallel welding wheel support is lifted and lowered through jacking connection of eccentric wheels to the semi-square-shaped jacking frame body, and conversion between the welding state and the to-be-welded state of the two parallel welding wheels is completed. The sealing and welding quality of the packaging assembly is greatly improved.

Description

technical field [0001] The invention relates to a microelectronic packaging device, in particular to a mechanism and a welding method for parallel welding a thin-shell device cover plate and a tube shell in a microelectronic packaging assembly in a high-vacuum chamber. Background technique [0002] Microelectronic packaging and assembly (MEMS devices), that is, using film technology and micro-processing technology to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the connection terminals, and potting and fixing them through plastic insulating media. Then, according to the electrical schematic diagram or logic diagram, using microelectronic technology and high-density assembly technology, microelectronic devices and micro-miniature components are assembled into applicable and producible electronic components, components or a technical process of a system; currently, vacuum packaging The equipment is changing from a single machine ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B23K31/02B23K37/02
CPCB81C1/00269B23K31/02B23K37/0252
Inventor 王成君胡北辰杨晓东靳丽岩李安华范旭利
Owner 西北电子装备技术研究所
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