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Rare earth surface treatment agent for improving electrochemical corrosion resistance of copper foil surface and surface treatment process

A surface treatment agent and corrosion performance technology, applied in the field of electrolytic copper foil, can solve the problems of unsatisfactory electrochemical corrosion resistance, insufficient fine and uniform crystallization of the alloy layer, etc., to improve the electrochemical corrosion resistance and electrochemical resistance Corrosion, the effect of improving the uniformity of densification

Active Publication Date: 2022-03-01
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the galvanizing process on the surface of copper foil has the phenomenon that the crystallization of the alloy layer is not fine and uniform, and the electrochemical corrosion resistance is not ideal.

Method used

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  • Rare earth surface treatment agent for improving electrochemical corrosion resistance of copper foil surface and surface treatment process

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Embodiment 1

[0023] A rare earth surface treatment agent for improving the electrochemical corrosion resistance of copper foil surface, comprising the following components: potassium pyrophosphate 130g / L, zinc sulfate 10g / L, nickel sulfate 15g / L, sodium borate 10g / L, cerium sulfate 1g / L, Additive A 5mg / L. Wherein, the additive A is SPS, and the solvent of the surface additive is deionized water.

[0024] A surface treatment process for improving the electrochemical corrosion resistance of the surface of copper foil, comprising the following steps: placing the copper foil with a thickness of 12 μm after pickling, roughening, and curing treatment in an electrolytic cell containing the above-mentioned surface treatment agent, and controlling the process The condition pH is 9, the temperature is 35°C, and the current density is 1.5A / dm 2 , The electroplating time is 8s.

Embodiment 2

[0026] A rare earth surface treatment agent for improving the electrochemical corrosion resistance of copper foil surface, comprising the following components: potassium pyrophosphate 135g / L, zinc sulfate 8g / L, nickel sulfate 15g / L, sodium borate 12g / L, cerium sulfate 1g / L, Additive A 5mg / L. Wherein, the additive A is PEG, and the solvent of the surface additive is deionized water.

[0027] A surface treatment process for improving the electrochemical corrosion resistance of the surface of copper foil, comprising the following steps: placing the copper foil with a thickness of 12 μm after pickling, roughening, and curing treatment in an electrolytic cell containing the above-mentioned surface treatment agent, and controlling the process Conditions pH is 9.5, temperature is 38°C, current density is 2A / dm 2 , The electroplating time is 6s.

Embodiment 3

[0029] A rare earth surface treatment agent for improving the electrochemical corrosion resistance of copper foil surface, comprising the following components: potassium pyrophosphate 140g / L, zinc sulfate 8g / L, nickel sulfate 15g / L, sodium borate 10g / L, lanthanum sulfate 1g / L, Additive A 5mg / L. Wherein, the additive A is SPS, and the solvent of the surface additive is deionized water.

[0030] A surface treatment process for improving the electrochemical corrosion resistance of the surface of copper foil, comprising the following steps: placing the copper foil with a thickness of 12 μm after pickling, roughening, and curing treatment in an electrolytic cell containing the above-mentioned surface treatment agent, and controlling the process The condition pH is 10, the temperature is 42°C, and the current density is 2.5A / dm 2 , The electroplating time is 5s.

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Abstract

The invention relates to the technical field of electrolytic copper foils, and discloses a rare earth surface treating agent for improving the electrochemical corrosion resistance of the surface of a copper foil, the rare earth surface treating agent comprises the following components: potassium pyrophosphate, zinc sulfate, nickel sulfate, metalloid salt, an additive A and rare earth salt, and the electrochemical corrosion resistance of the surface of the copper foil can be effectively improved. According to the method, a Zn-Ni-metalloid element (Si, As and B)-rare earth element (La, Ce, Pr and Nd) quaternary alloy coating is electrolytically deposited on the surface of the copper foil, so that the electrochemical corrosion resistance of the surface of the copper foil is improved. The metalloid can enable the coating to be in an amorphous state, so that the electrochemical corrosion resistance of the coating is improved; the rare earth element has characteristic adsorption, can effectively improve the compactness uniformity of the microstructure of the plating layer, and can also effectively improve the electrochemical corrosion resistance of the plating layer.

Description

technical field [0001] The invention belongs to the field of electrolytic copper foil, and in particular relates to a rare earth surface treatment agent and a surface treatment process for improving the electrochemical corrosion resistance of the copper foil surface. Background technique [0002] With the rapid development of the electronic information industry, the performance requirements for electrolytic copper foil are gradually increasing. The electrochemical corrosion resistance of electrolytic copper foil is still significantly different from that of foreign countries and needs to be improved. [0003] Relevant studies have shown that metalloids can make the coating appear amorphous and improve the electrochemical corrosion resistance of the coating. While maintaining the performance of the original plating solution, changing the composition and content of the additive can improve the stability of the plating solution, obtain better coating quality, and improve its p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D7/06C25D21/12
CPCC25D3/56C25D7/0614C25D21/12Y02E60/10
Inventor 范翠玲王学江谢锋孙云飞王先利张艳卫刘铭魏文琦
Owner SHANDONG JINBAO ELECTRONICS
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