Method for improving electroforming thickness uniformity of wafer-level array microstructure

Abstract

The invention discloses a method for improving the uniformity of the electroforming thickness of a wafer-level array microstructure, and the method comprises the steps: guaranteeing the consistency of the surface current density distribution of the whole array microstructure through installing an auxiliary cathode at the periphery of a wafer cathode and applying a direct current; and meanwhile, the reverse pulse current is applied to the surface of the wafer cathode to perform electrochemical micro-leveling on the microstructure unit in the array, and based on the high synergistic effect of the auxiliary cathode and the reverse pulse current, the uniformity of the electroforming thickness of the wafer-level array microstructure is improved. The method overcomes the defects that an existing method is poor in universality, low in machining efficiency and the like, avoids the edge effect problem in a traditional electroforming process and the problem of low deposition rate in a reverse pulse electroforming process, and can obtain a microstructure electroforming layer which is uniform in thickness and good in organization structure and performance consistency on the surface of a 4-6 inch wafer at the high current density of 2-8 A / dm < 2 >; and the auxiliary cathode can be repeatedly used, and the method is simple and easy to implement and has higher practicability.

Description

technical field [0001] The invention relates to the field of micro-manufacturing technology, in particular to a method for improving the thickness uniformity of wafer-level array microstructure electroforming. Background technique [0002] With the development of micro-electromechanical systems (MEMS) technology, electroforming technology, as an important micro-fabrication method, has been widely used in aerospace, precision machinery, biomedicine, communication and other fields. Most of the current work related to the electroforming process uses a small-area wafer substrate as the cathode to fabricate microstructures, which limits the number of layouts of micropatterns on the substrate, thereby affecting production efficiency. In addition, the current density distribution on the cathode surface is not uniform in the process of making micro devices by electroforming technology, and the problem of inconsistent thickness between the edge area and the middle area of ​​the elect...

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Problems solved by technology

Unfortunately, shortening the pulse interval to the millisecond range severely compromises the efficiency of the electroforming process

At the same time, the application of reverse pulse current also faces the problem of uneven current density distribution, which limits the application of this technology in wafer array microstructure electroforming

It can be seen that although the existing improved methods have improved the uniformity of the electroforming layer to a certain extent, the disadvantages of low electroforming efficiency and poor versatility still exist, which limit its application in actual production, so a A Novel Method for Improving Thickness Uniformity of Electroformed Microstructures in Wafer-Level Arrays

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