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Method for machining small hole in transparent hard and brittle material based on laser pulse control

A laser pulse, hard and brittle material technology, applied in the direction of manufacturing tools, laser welding equipment, metal processing equipment, etc., can solve the problems of reduced processing quality, thin material thickness, edge collapse of holes, etc., to improve edge quality, verticality The effect of high and low thermal stress gradient

Pending Publication Date: 2022-03-04
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the processing of small holes on transparent hard and brittle materials such as glass, high-repetition-frequency nanosecond lasers are generally used for processing. The thermal action of nanosecond lasers will induce local thermal stress gradients, resulting in cracking of materials within a limited space and It falls in the form of tiny particles, so irregular edge chipping often exists during processing, especially when it is processed close to the upper surface, the thickness of the material is thin and the strength is low, which is particularly easy to cause serious edge chipping at the edge of the hole, reducing the Processing quality

Method used

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  • Method for machining small hole in transparent hard and brittle material based on laser pulse control
  • Method for machining small hole in transparent hard and brittle material based on laser pulse control
  • Method for machining small hole in transparent hard and brittle material based on laser pulse control

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Effect test

Embodiment 1

[0029] The laser processing technology for small holes in transparent hard and brittle materials of the present invention, its specific process is processed as follows:

[0030] Select ultra-clear glass with a thickness of 20mm, immerse it in a glass beaker filled with absolute ethanol, and then put it into an ultrasonic cleaner filled with clean water for 2 minutes to remove surface pollutants. Take out the sample, and use a hot air blower to dry the residual moisture on the surface. Keep the ultra-clear glass horizontally fixed on the two-dimensional mobile platform, adjust the position of the sample, focus the laser spot on the position to be processed, and adjust the height of the galvanometer to focus the laser focus on the lower surface of the sample. The scanning pattern of the galvanometer scanning mode is a spiral line, the diameter of the small hole to be processed is 1mm, and the filling pitch of the spiral line is 0.05mm, such as figure 1 shown.

[0031] Set the ...

Embodiment 2

[0033] The laser processing technology for small holes in transparent hard and brittle materials of the present invention, its specific process is processed as follows:

[0034] Select ultra-clear glass with a thickness of 9 mm, immerse it in a glass beaker filled with absolute ethanol, and then put it into an ultrasonic cleaner filled with clean water for 2 minutes to remove surface pollutants. Take out the sample, and use a hot air blower to dry the residual moisture on the surface. Keep the ultra-clear glass horizontally fixed on the two-dimensional mobile platform, adjust the position of the sample, focus the laser spot on the position to be processed, and adjust the height of the galvanometer to focus the laser focus on the lower surface of the sample. The scanning pattern of the galvanometer scanning mode is a spiral line, the diameter of the small hole to be processed is 1mm, and the filling pitch of the spiral line is 0.05mm, such as figure 1 shown.

[0035]Set the n...

Embodiment 3

[0037] The laser processing technology for small holes in transparent hard and brittle materials of the present invention, its specific process is processed as follows:

[0038] Select borosilicate glass (BF33) with a thickness of 5 mm, immerse it in a glass beaker filled with absolute ethanol, and then put it into an ultrasonic cleaner filled with clean water for 2 minutes to remove surface pollutants. Take out the sample, and use a hot air blower to dry the residual moisture on the surface. Keep the borosilicate glass horizontally fixed on the two-dimensional mobile platform, adjust the position of the sample, focus the laser spot on the position to be processed, and adjust the height of the galvanometer to focus the laser focus on the lower surface of the sample. The scanning pattern of the galvanometer scanning mode is a spiral line, the diameter of the small hole to be processed is 1mm, and the filling pitch of the spiral line is 0.05mm, such as figure 1 shown.

[0039]...

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Abstract

The invention provides a method for processing small holes in a transparent hard and brittle material based on laser pulse control, which comprises the following steps of: setting the number of processing layers from bottom to top along the thickness direction of the hard and brittle transparent material as P, selecting the layers from the first to the Qth to adopt a galvanometer scanning mode, and processing the small holes layer by layer along the thickness direction of the material from bottom to top, after laser scanning of one layer is completed, the laser focus is stepped upwards by one layer, and after machining of the Qth layer is completed, the hard and brittle transparent material is cooled; wherein Q is greater than or equal to P-5 and less than or equal to P-1; and small hole machining is conducted on the (Q + 1) th layer to the Pth layer in a laser vector dotting mode. According to the invention, the heat accumulation effect of the high repetition frequency nanosecond laser can be effectively reduced, so that the edge breakage of the edge of the small hole is reduced, and the small hole with good edge quality is obtained.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a method for processing small holes in transparent hard and brittle materials based on laser pulse control. Background technique [0002] In the field of precision processing, for transparent hard and brittle materials with high hardness and high melting point such as glass, quartz, and sapphire, there are certain limitations in using traditional drilling methods such as mechanical drilling, which may easily cause irregular drilling edges and surface chipping Seriously, it affects the strength and performance of the material, and the diameter of the processed small hole is relatively large, which is not suitable for processing small holes with a diameter of less than 2mm. [0003] Laser processing technology is a precision processing technology with no contact, less thermal damage, and flexible processing. It can process a wide range of materials, obtain holes with a lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/0622B23K26/082B23K26/60
CPCB23K26/382B23K26/0624B23K26/082B23K26/60
Inventor 任云鹏程力叶云霞任旭东涂新诚何坤
Owner JIANGSU UNIV
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