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Temporary bonding glue for wafer processing, and preparation method and application thereof

A temporary bonding glue and wafer technology, applied in the field of bonding glue, can solve the problems affecting the processing quality and processing efficiency of wafers, edge corrosion of bonding glue, uneven thickness of chips, etc., to achieve good bonding effect, enhance internal The effect of increased cohesion strength, degree of staggered overlap

Active Publication Date: 2022-03-08
ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the semiconductor wafer has weak mechanical strength after thinning, it is prone to internal warpage due to stress, resulting in wafer damage, especially in the chemical mechanical polishing process, the processing temperature and chemical corrosion increase, and the thermal stress is enhanced. Conventional Temporary bonding adhesive is heated and deformed, the force on the wafer is uneven, and the edge of the bonding adhesive is corroded, which is prone to uneven thickness of the chip, and technical problems such as slippage, fragmentation, and edge chipping, which seriously affect the quality and efficiency of wafer processing

Method used

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  • Temporary bonding glue for wafer processing, and preparation method and application thereof
  • Temporary bonding glue for wafer processing, and preparation method and application thereof
  • Temporary bonding glue for wafer processing, and preparation method and application thereof

Examples

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Effect test

Embodiment 1-12

[0048] Examples 1-12 disclose a variety of temporary bonding adhesives for wafer processing, and their components and parts by mass are shown in Table 1.

[0049] Embodiments 1-12 The preparation methods of various temporary bonding adhesives for wafer processing are as follows:

[0050] Step (1): Add a high boiling point solvent and a low boiling point solvent into the stirred tank and stir to mix evenly; the stirring condition is: 70r / min stirring for 5min;

[0051] Step (2): Heat the solution obtained in step (1) to 40°C, add tackifying resin under continuous stirring, and stir until a clear and transparent liquid is formed; the stirring condition is: 80r / min stirring for 50min;

[0052] Step (3): Add plasticizer, wetting agent and antioxidant to the solution obtained in step (2), and stir until a clear and transparent liquid is formed; the stirring condition is: stirring at 80r / min for 40min;

[0053] Step (4): Add polymeric resin to the solution obtained in step (3), and...

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Abstract

The invention provides a temporary bonding adhesive for wafer processing, and a preparation method and application thereof. The temporary bonding adhesive for wafer processing comprises the following components in parts by mass: 0.1-5 parts of polymer resin, 20-50 parts of tackifying resin, 1-5 parts of a reinforcing agent, 1-5 parts of a plasticizer, 10-50 parts of a high-boiling-point solvent, 10-30 parts of a low-boiling-point solvent, 0.5-5 parts of a wetting agent and 0.1-0.5 part of an antioxidant. The invention also discloses a preparation method and application of the temporary bonding glue for wafer processing. The temporary bonding adhesive for wafer processing is high in thermal stability, high in chemical corrosion resistance, high in bonding force and uniform in wafer bonding, and can be widely applied to wafer processing.

Description

technical field [0001] The invention relates to bonding glue technology, in particular to a temporary bonding glue for wafer processing, its preparation method and application. Background technique [0002] In the field of semiconductor technology, for semiconductor chip products such as LED chips, power chips, radio frequency chips, and communication chips, substrates such as sapphire, silicon carbide, gallium nitride, gallium arsenide, and germanium are usually used. In the grinding and polishing process in the back-end process, the temporary bonding glue is the core material of chip processing, which is very important to the chip processing quality and protection. [0003] As one of the core materials of the semiconductor industry, the performance of the wafer directly affects the development level of the semiconductor industry. With the development of semiconductor processing technology, the processing efficiency and product quality requirements are further improved. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J175/04C09J11/08C09J11/06C09J11/04H01L21/683
CPCC09J123/0853C09J175/04C09J11/08C09J11/06C09J11/04H01L21/6836H01L2221/68354C08L2203/20C08L2201/08C08K2201/011C08L75/04C08L93/04C08L57/02C08K9/06C08K3/34C08K5/09C08L23/0853C08K5/01C08L91/06C08K3/22C08K9/04C08K7/26C08K5/521
Inventor 侯军李传强
Owner ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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