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Conductive silver adhesive and preparation method and application thereof

A technology of conductive silver glue and conductive filler, applied in the application, conductive adhesive, adhesive and other directions, can solve the problems of poor conductivity stability, reduced conductivity, poor elasticity, etc.

Inactive Publication Date: 2022-03-15
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the conductive silver glue mainly uses epoxy resin as the matrix resin, the rubber is a flexible macromolecule, and the long-chain flexible amine is the curing agent. Although the prepared conductive silver glue has certain elasticity, the conductivity is reduced and the elasticity is poor. Poor conductive stability after stretching

Method used

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  • Conductive silver adhesive and preparation method and application thereof
  • Conductive silver adhesive and preparation method and application thereof
  • Conductive silver adhesive and preparation method and application thereof

Examples

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preparation example Construction

[0035] In the present invention, the preparation method of described KH-560 graft-modified flake silver powder preferably comprises the following steps:

[0036] 1) KH-560 is mixed with hydrochloric acid solution to obtain mixture;

[0037] 2) Mix the mixture obtained in the step 1) with the flaky silver powder, and carry out a graft reaction to obtain KH-560 graft-modified flaky silver powder.

[0038] In the present invention, KH-560 is preferably mixed with hydrochloric acid solution to obtain a mixed material.

[0039]The source of the KH-560 is not particularly limited in the present invention, and a commercially available product well known to those skilled in the art can be used. The present invention has no special limitation on the operation of mixing the KH-560 with the hydrochloric acid solution, and the technical solution for preparing the mixed material well known to those skilled in the art can be used. The present invention has no special limitation on the con...

Embodiment 1～4

[0076] In Examples 1-4, the conductive silver glue was prepared from the raw materials shown in Table 1, and the unit was the mass fraction;

[0077] Table 1 Examples 1-4 Raw materials of conductive silver paste

[0078]

[0079]

[0080] Among them, the polyurethane modified epoxy resin is GHP-11 of Yitai Le Electronics Co., Ltd. (with curing agent); the elastic polyurethane is Dolphin New Material 1714 polyurethane; diethylene glycol and diethylene glycol monoethyl ether acetate are analytical grade; spherical silver powder The particle size of the silver nanowire is 500nm; the diameter of the nano-silver wire is 20-25nm; the size of the flake silver powder is 200nm×1μm;

[0081] The flaky silver powder is KH-560 graft modified flaky silver powder, and the spherical silver powder is KH-560 graft modified spherical silver powder. The pH value reached 4, then silver powder was added, and then the graft reaction was carried out by stirring in a constant temperature water...

Embodiment 5～8

[0093] In Examples 5-8, the conductive silver glue is prepared from the raw materials shown in Table 3, and the unit is parts by mass;

[0094] Table 3 The raw materials of the conductive silver pastes of Examples 5-8

[0095] Example 5 6 7 8 Polyurethane Modified Epoxy Resin 70 70 70 70 elastic polyurethane 10 10 10 10 Diethylene glycol 10 10 10 10 Diethylene glycol monoethyl ether acetate 10 10 10 10 Flake silver powder 50 30 20 10 Linear graphite powder 10 30 40 50

[0096] Among them, the polyurethane modified epoxy resin is GHP-11 of Yitai Le Electronics Co., Ltd. (containing curing agent); the elastic polyurethane is Dolphin New Material 1714 polyurethane; diethylene glycol and diethylene glycol monoethyl ether acetate are analytically pure; The size of silver powder is 200nm×1μm; the aspect ratio of linear graphite is 5:1, and the size is 5μm;

[0097] The flaky silver powder is KH-560 graft-modifi...

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Abstract

The invention provides a conductive silver adhesive. The conductive silver adhesive is prepared from the following raw materials in parts by mass: 40-90 parts of polyurethane modified epoxy resin, 10-30 parts of elastic polyurethane, 5-20 parts of diethylene glycol monoethyl ether acetate, 5-20 parts of diethylene glycol and 40-90 parts of conductive filler, the conductive filler is at least one of flaky silver powder, spherical silver powder, nano silver wire, linear graphite powder and spherical graphite powder. According to the conductive silver adhesive provided by the invention, the polyurethane modified epoxy resin is used as a base material, the elastic polyurethane is used as a flexible material, and the diethylene glycol and the diethylene glycol monoethyl ether acetate are used as auxiliaries, so that the compatibility of a system is improved, and the conductive silver adhesive still has excellent conductive stability after being stretched in cooperation with the conductive filler. The result of the embodiment shows that the sheet resistance of the conductive silver adhesive before stretching is 0.56-1029 omega, and the sheet resistance of the conductive silver adhesive after 5% stretching is 1.92-1498 omega.

Description

technical field [0001] The invention belongs to the technical field of conductive silver glue, and particularly relates to a conductive silver glue and a preparation method and application thereof. Background technique [0002] Since its introduction in 1966, conductive silver glue has played an increasingly important role in electronic technology. At present, conductive silver glue has been widely used in the packaging of semiconductor integrated circuits, the surface circuit wiring of integrated circuits, computer soft circuit wiring, liquid crystal displays, light-emitting diodes, organic light-emitting screens, printed circuit boards, piezoelectric ceramics and flux replacement. and many other fields. [0003] At present, the conductive silver glue mainly uses epoxy resin as the matrix resin, rubber as the flexible macromolecule, and long-chain flexible amine as the curing agent. Although the prepared conductive silver glue has a certain elasticity, the conductivity is ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J11/06G01L1/20G01N3/32A61B5/08A61B5/113A61B5/00
CPCC09J163/00C09J9/02C09J11/06G01L1/20G01N3/32A61B5/08A61B5/113A61B5/6823C08K2003/0806C08K2201/001A61B2562/12A61B2562/16C08L75/04C08K5/06C08K5/101C08K9/06C08K7/18C08K7/06C08K3/08C08K7/00C08K3/04
Inventor 马辉
Owner JIAXING UNIV
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