Insulating adhesive film with low dielectric loss and preparation method and application thereof

An insulating film and low dielectric technology, applied in the field of resin composite materials, can solve the problems of component heating affecting normal operation, good dielectric loss of insulating film, high dielectric loss and power consumption, etc., to achieve low dielectric loss, The effect of improving signal transmission speed and long service life

Pending Publication Date: 2022-03-15
深圳市纽菲斯新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] It can be seen from the above that insulating adhesive films are widely used in the fields of printed circuit boards and chip packaging, but the dielectric loss of existing insulating adhesive films is relatively good, and its high dielectric loss will not only consume electric energy, but also easily cause components to heat up Affect its normal operation; if the dielectric loss is too high, it may even cause overheating of the medium and damage the insulation

Method used

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  • Insulating adhesive film with low dielectric loss and preparation method and application thereof

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Embodiment 1

[0089] This embodiment provides an insulating adhesive film with low dielectric loss and a preparation method thereof. The insulating adhesive film with low dielectric loss includes the following components in parts by weight:

[0090] 15 parts of cyanate ester resin, 10 parts of aliphatic bismaleimide resin, 120 parts of silicon dioxide, 25 parts of bisphenol AF type liquid epoxy resin, 1.5 parts of phenoxy resin, diallyl bisphenol A5 parts, 0.5 parts of curing accelerator, 2 parts of flame retardant (HCA-HQ), 3 parts of organic filler and 150 parts of toluene.

[0091] The preparation method of the above-mentioned insulating adhesive film with low dielectric loss is as follows:

[0092] (1) Mix cyanate ester resin, aliphatic bismaleimide resin and toluene evenly, add diallyl bisphenol A and mix, and perform modification treatment at 130°C for 10 minutes, then cool to room temperature, get the mixture;

[0093] (2) After mixing the mixture obtained in step (1) with the rema...

Embodiment 2

[0095] This embodiment provides an insulating adhesive film with low dielectric loss and a preparation method thereof, and the difference from Embodiment 1 is only:

[0096] 5 parts of diallyl bisphenol A are replaced with 2 parts of polyhedral oligomeric silsesquioxane (POSS);

[0097] The preparation method of the above-mentioned insulating adhesive film with low dielectric loss is as follows:

[0098] (1) After mixing cyanate ester resin, aliphatic bismaleimide resin and toluene evenly, add polyhedral oligomeric silsesquioxane (POSS) and mix, and perform modification treatment at 120°C for 15 minutes, Cool to room temperature to obtain the mixture;

[0099] (2) After mixing the mixture obtained in step (1) with the remaining components of the low dielectric loss insulating adhesive film, coat it on the PET release film, dry it at 80°C for 10 minutes, and then remove the PET release film , to obtain a low dielectric loss insulating adhesive film with a thickness of 100 μm....

Embodiment 3

[0101] This embodiment provides an insulating adhesive film with low dielectric loss and a preparation method thereof, and the difference from Embodiment 1 is only:

[0102] Also include 2 parts of polyhedral oligomeric silsesquioxane (POSS) in the insulating adhesive film of described low dielectric loss,

[0103] The preparation method of the above-mentioned insulating adhesive film with low dielectric loss is as follows:

[0104] (1) After mixing cyanate resin, aliphatic bismaleimide resin and toluene evenly, add diallyl bisphenol A and polyhedral oligomeric silsesquioxane (POSS) to mix, and heat After carrying out the modification treatment for 15 minutes at a lower temperature, it was cooled to room temperature to obtain a mixture;

[0105] (2) After mixing the mixture obtained in step (1) with the remaining components of the insulating adhesive film with low dielectric loss, apply it on the PET release film, dry it at 130°C for 3 minutes, and then remove the PET release...

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Abstract

The invention provides an insulating adhesive film with low dielectric loss and a preparation method and application thereof. The insulating adhesive film comprises the following components in parts by weight: 10-15 parts of cyanate ester resin, 5-10 parts of bismaleimide resin, 80-180 parts of an inorganic filling material, 15-40 parts of epoxy resin, 1-10 parts of thermoplastic resin and 0.5-7 parts of a modifier, the modifier comprises an allyl compound and / or a porous nano material. The insulating adhesive film provided by the invention has relatively low dielectric loss, can improve signal transmission speed and reduce signal transmission interference, has relatively high reliability and relatively long service life, and can be used for printed circuit board and chip packaging and the like.

Description

technical field [0001] The invention belongs to the technical field of resin composite materials, and in particular relates to a low dielectric loss insulating adhesive film and its preparation method and application. Background technique [0002] With the development of electronic information technology, especially the rapid development of wearable electronics, smart phones, ultra-thin computers, unmanned driving, Internet of Things technology and 5G communication technology in recent years, the miniaturization and thinning of electronic systems , multi-functional, high performance and other aspects have put forward higher and higher requirements. Insulating dielectric material is an important material in electronic packaging technology. Compared with ceramic dielectric materials, polymer-based dielectric composite materials have the advantages of easy processing, low price, and light weight, and have been widely used in the field of electronic packaging. Therefore, insul...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/04C09J179/08C09J11/04C09J11/06C09J11/08C09J7/30C09J7/10
CPCC09J163/00C09J11/04C09J11/06C09J11/08C09J7/30C09J7/10C09J2203/326C09J2463/00C08L2205/025C08L79/04C08L79/085
Inventor 何岳山许伟鸿杨柳刘飞练超李东伟王粮萍刘汉成
Owner 深圳市纽菲斯新材料科技有限公司
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