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Wafer precision thinning processing grinding wheel and preparation method thereof

A grinding wheel, precision technology, applied in the field of wafer precision thinning processing grinding wheel and its preparation, can solve the problems of high dependence, coarse powder particle size, uneven particle size, etc., and achieve the effect of reducing thermal damage

Pending Publication Date: 2022-03-22
江苏华东砂轮有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the production of diamond abrasive tools for semiconductor precision machining is still in a blank state of technical blockade. There has been a long-term lack of basic research and development of precision machining technology for single crystal silicon materials. Coarse, uneven particle size and other common problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Step 1: Raw material configuration, respectively configure multi-component inorganic sol and sol-gel slurry, and take out 100kg multi-component inorganic sol and 200kg sol-gel slurry for uniform stirring and mixing to obtain raw materials, multi-component inorganic sol It is an Al-Si-B-Na series multi-component high-strength nano-ceramic sol containing sodium borate, in which the content of sodium borate is 16.7%, and the sol-gel slurry is diamond ultrafine abrasive and filler with a mass ratio of 1:1 mixture;

[0025] Step 2: Injection molding, put the raw materials into a disc-shaped mold and inject into a green body. The ligand is a circular structure with a diameter of 20 cm and a thickness of 0.2 cm;

[0026] Step 3: drying, put the green body in an oven for drying, the drying temperature of the oven is set at 45°C, and the drying time is 25 minutes;

[0027] Step 4: Sintering, put the dried green body into a sintering furnace for sintering and molding, and sinter...

Embodiment 2

[0030] Step 1: Raw material configuration, respectively configure multi-component inorganic sol and sol-gel slurry, and take out 100kg of multi-component inorganic sol and 210kg of sol-gel slurry for uniform stirring and mixing to obtain raw materials, multi-component inorganic sol It is an Al-Si-B-Na multi-component high-strength nano-ceramic sol containing sodium borate, in which the content of sodium borate is 18%, and the sol-gel slurry is diamond ultrafine abrasive and filler with a mass ratio of 1:1.1 mixture;

[0031] Step 2: Injection molding, put the raw materials into a disc-shaped mold and inject into a green body. The ligand is a circular structure with a diameter of 20 cm and a thickness of 0.2 cm;

[0032] Step 3: drying, put the body in an oven for drying, the drying temperature of the oven is set at 46°C, and the drying time is 20 minutes;

[0033] Step 4: Sintering, put the dried body into a sintering furnace for sintering and molding, and sintering in an oxy...

Embodiment 3

[0036] Step 1: Raw material configuration, respectively configure multi-component inorganic sol and sol-gel slurry, and take out 100kg of multi-component inorganic sol and 220kg of sol-gel slurry for uniform stirring and mixing to obtain raw materials, multi-component inorganic sol It is an Al-Si-B-Na multi-component high-strength nano-ceramic sol containing sodium borate, in which the content of sodium borate is 20%, and the sol-gel slurry is diamond ultrafine abrasive and filler with a mass ratio of 1:1.2 mixture;

[0037] Step 2: Injection molding, put the raw materials into a disc-shaped mold and inject into a green body. The ligand is a circular structure with a diameter of 20 cm and a thickness of 0.2 cm;

[0038] Step 3: drying, put the green body in an oven for drying, the drying temperature of the oven is set at 47°C, and the drying time is 18 minutes;

[0039]Step 4: Sintering, put the dried green body into a sintering furnace for sintering and molding, and sinterin...

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Abstract

The invention discloses a wafer precision thinning processing grinding wheel and a preparation method thereof, and relates to the technical field of grinding wheel production. The preparation method comprises the following steps: 1, preparing raw materials, namely respectively preparing multi-component inorganic sol and sol-gel slurry, and mixing the multi-component inorganic sol and the sol-gel slurry according to a ratio of 1: (2-2.5) to obtain the raw materials; 2, injection molding, wherein the raw materials are put into a disc-shaped mold to be subjected to injection molding to form a green body; 3, drying, wherein the green body is placed in a drying oven to be dried; and 4, sintering: putting the dried green body into a sintering furnace, and sintering to obtain a semi-finished product. In order to solve the common problems that in a traditional ceramic bond preparation method, the particle size of powder is large, the particle size is not uniform and the like, Al-Si-B-Na series multi-component sol is used as a bond precursor, different components in the bond can be evenly mixed on the molecular level, low-temperature and rapid sintering is achieved, energy is saved, and meanwhile heat damage of an abrasive material is reduced.

Description

technical field [0001] The invention relates to the technical field of grinding wheel production, in particular to a wafer precision thinning grinding wheel and a preparation method thereof. Background technique [0002] Semiconductor materials are important materials for making integrated circuits, electronic devices, and optoelectronic devices. The rapid development of the Internet is the cornerstone of the current new round of information revolution. With the development of network technology, the entire semiconductor industry (especially the chip field) has higher and higher requirements for the comprehensive performance of semiconductor materials, especially higher requirements for the processing accuracy of the workpiece surface, and the ultra-precision processing requirements for wafer materials. nanoscale. The development of new tools suitable for precision and ultra-precision processing of semiconductor materials and the improvement of the surface processing accur...

Claims

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Application Information

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IPC IPC(8): B24D18/00B24D3/18B24D3/34
CPCB24D18/009B24D3/18B24D3/346B24D3/342
Inventor 陈贵锋刘小磐陈沈萍陈瑞和王友堂吴祝艳
Owner 江苏华东砂轮有限公司